Technical Library: level-3 (Page 1 of 1)

EFFECTS OF ENIG NICKEL CORROSION ON WETTING BALANCE TEST RESULTS AND INTERMETALLIC FORMATION

Technical Library | 2023-01-10 20:03:37.0

Since the IPC-4552 rev A for ENIG was introduced there have been many requests for clarification of acceptable and unacceptable levels of nickel corrosion. This paper attempts to further clarify the effects of nickel corrosion on solder wetting balance test results and the resultant intermetallic formed. The study will attempt to produce level 1, level 2, and level 3 corrosion as denoted by IPC-4552 rev A and tabulate wetting balance results and congruity of intermetallic formed.

Uyemura International Corporation

  1  

level-3 searches for Companies, Equipment, Machines, Suppliers & Information

thru hole soldering and selective soldering needs

Training online, at your facility, or at one of our worldwide training centers"
High Throughput Reflow Oven

High Resolution Fast Speed Industrial Cameras.
SMT feeders

Software for SMT placement & AOI - Free Download.
PCB Handling Machine with CE

High Throughput Reflow Oven
SMT spare parts

SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...