New SMT Equipment: lf318 (1)

MULTICORE Solder Pastes

MULTICORE Solder Pastes

New Equipment | Solder Materials

As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr

Henkel Electronic Materials

Electronics Forum: lf318 (3)

Voiding in LGA (LT) soldering

Electronics Forum | Fri Sep 03 10:52:39 EDT 2010 | arjan

Mark, Can you send some X-ray foto's of your LGA solderjoints, I am curious about the results of a marginal paste volume in combination with the Multicore LF318. Did you follow the recommandation of LT and use also soldermask defined pads on your bo

Voiding in LGA (LT) soldering

Electronics Forum | Tue Aug 31 04:05:23 EDT 2010 | arjan

Hi Mark, Thanks for your responce! The stencil thickness and especially the reduction of 45% are not recommend by LT, did you came to this combination experimentally? We never have the illusion to produce voiding free, but now its around the accepta

Industry News: lf318 (1)

Henkel Debuts High-Reliability Pb-Free Solder Alloy for High-Temperature Applications

Industry News | 2013-03-04 12:11:10.0

Developed alongside and accepted by the automotive industry, Henkel Electronic Materials announces the commercial availability of 90iSC, a high-reliability, lead-free solder alloy for demanding high-temperature applications. The new alloy, which addresses the drawbacks certain products experience with traditional SAC alloys, has been proven as a viable lead-free solution for applications where extremely high reliability is required.

Henkel Electronic Materials


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