Industry Directory: lga (13)

Precision PCB Services, Inc

Industry Directory | Consultant / Equipment Dealer / Broker / Manufacturer's Rep / Service Provider / Training Provider

Products, Services, Training, and Consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep & Sole Agent in North America for Shuttle Star BGA Rework Stations.

Tianjin Reains Technologies Co., Ltd

Industry Directory | Adhesives / Dispensing

Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.

New SMT Equipment: lga (106)

BULB-VAC with anti-wobble cone and 3/4

BULB-VAC with anti-wobble cone and 3/4" ESD vacuum cup

New Equipment | Hand Assembly

The anti-wobble tool is designed for enhanced functionality when handling INTEL LGA CPU products. This tool improves placment accuracy when picking processor chips from a shipping tray and placing into precision sockets. This BULB-VAC features an ant

Virtual Industries, Inc.

BGA Reballing Fixture, Hi Yield

BGA Reballing Fixture, Hi Yield

New Equipment | Rework & Repair Equipment

Custom made reballing fixtures designed for your specific component.  Allows for high yield reballing of multiple parts at one time.  Use for ball attach to BGA components and for solder bumping of LGA's and QFN's.  Simply send us the data sheet and

Precision PCB Services, Inc

Electronics Forum: lga (207)

LGa soldering issues......

Electronics Forum | Mon Aug 10 12:28:17 EDT 2009 | davef

We don't know dip about your Linear Tech LGA118, but we agree with published reports that say you should have between 4800 and 7000 thou^3 of paste on the pad for a LGA. These volumes were analyzed based on volumes found successful for CGA and then e

Voiding in LGA (LT) soldering

Electronics Forum | Thu Sep 02 07:50:27 EDT 2010 | sachu_70

Just to add to my comments,solder joint voids do occur in LGA. Voids in LGA can be larger due to geometry and greater ratio of flux to solder. IPC-A-610D specifies a greater than 25% voided area is a defect for BGA, however, it does not specify the d

Industry News: lga (98)

Virtual Industries to Showcase Leading Vacuum Handling Solutions at SPIE Photonics West 2011

Industry News | 2011-01-05 16:07:01.0

Virtual Industries Inc. announces that it will display several advanced systems in Booth 2141 at the upcoming SPIE Photonics West exhibition, scheduled to take place January 22-27, 2011 at the Moscone Center in San Francisco.

Virtual Industries, Inc.

Virtual Industries Announces Small Part Handling Kit Special at the 2012 IPC APEX Expo

Industry News | 2012-01-20 15:26:12.0

Virtual Industries will display several advanced systems in Booth #628 at the upcoming IPC APEX Expo.

Virtual Industries, Inc.

Parts & Supplies: lga (6)

Panasonic Cutter N210186479AA

Panasonic Cutter N210186479AA

Parts & Supplies | THT Equipment

Panasonic Cutter N210186479AA Panasonic smt spare parts smt machine KXFB02LDA01 JOINT KXFB02LEA01 BRACKET KXFB02LGA01 PLATE KXFB02LJA00 COLLAR KXFB02LKA00 STOPPER KXFB02LLA00 COLLAR KXFB02LMA00 SHAFT KXFB02LNA00 HOLDER KXFB02LPA01 COLLAR

Qinyi Electronics Co.,Ltd

Panasonic BLOCK

Panasonic BLOCK

Parts & Supplies | SMT Equipment

We also supply following Panasonic Spare parts : N210001930AA JOINT N210007424AA BRACKET KXFB02LGA01 PLATE KXFB02LJA00 COLLAR KXFB02LKA00 STOPPER N210007491AA SHAFT KXFB02LRA00 MANIFOLD KXFB02LUA05 SHAFT KXFB02LVA00 GUIDE KXFB02M4A02 PLAT

Qinyi Electronics Co.,Ltd

Technical Library: lga (8)

Solder Joint Encapsulant Adhesive - LGA High Reliability And Low Cost Assembly Solution

Technical Library | 2016-01-12 11:01:25.0

More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.

YINCAE Advanced Materials, LLC.

Room Temperature Fast Flow Reworkable Underfill For LGA

Technical Library | 2016-10-03 08:28:47.0

With the miniaturization of electronic device, Land Grid Array (LGA) or QFN has been widely used in consumer electronic products. However there is only 20-30 microns gap left between LGA and the substrate, it is very difficult for capillary underfill to flow into the large LGA component at room temperature. Insufficient underfilling will lead to the loss of quality control and the poor reliability issue. In order to resolve these issues, a room temperature fast flow reworkable underfill has been successfully developed with excellent flowability. The underfill can flow into 20 microns gap and complete the flow of 15mm distance for about 30 seconds at room temperature. The curing behavior, storage, thermal cycling performance and reworkability will be discussed in details in this paper.

YINCAE Advanced Materials, LLC.

Videos: lga (13)

iico, upcycle to affordability, flexibility and performance

iico, upcycle to affordability, flexibility and performance

Videos

The new iico system from Europlacer is ideal for small businesses and dedicated prototype operations providing a rapid return on investment. Upcycle to the flexibility of an "iico system" with the latest proven Europlacer innovations ready for curren

EUROPLACER

How to use the BULB-VAC with a vacuum cup.

How to use the BULB-VAC with a vacuum cup.

Videos

How to use the BULB-VAC with a vacuum cup

Virtual Industries, Inc.

Training Courses: lga (4)

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: lga (10)

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures

Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures

Surface Mount Technology Association (SMTA)

Leadless Device Rework

Events Calendar | Mon Mar 16 07:30:00 EDT 2015 - Tue Mar 17 16:00:00 EDT 2015 | Rolling Meadows, USA

Leadless Device Rework

BEST Inc.

Career Center - Resumes: lga (2)

Staff Process Engineer

Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control

15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience

Debug engineer or bga rework engineer

Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support

tel u later

Express Newsletter: lga (24)

Partner Websites: lga (245)

BGA Rework Training and Certification – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training

. We will show you what we use to acheive our zero defect process.  The lateses processes, materials, equipment and techniques for rework of BGA, QFN, LGA, PoP and other SMD components. Key Topics Include

Precision PCB Services, Inc

SMT Reflow Oven -MK5 SMT Reflow Oven

Heller Industries Inc. | https://hellerindustries.com/1913-mark-5-series-smt-reflow-oven/

×   SMT Reflow Oven -1913 MK5 Best value SMT Reflow Oven in the market. Designed for Low Cost of ownership. 1913 Mark V Non-LGA 1913 Mark V LGA The ultimate high volume Surface Mount Technology production solution with belt speeds up to

Heller Industries Inc.


lga searches for Companies, Equipment, Machines, Suppliers & Information

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Benchtop Fluid Dispenser

ONLINE IPC Training & Certification
SMT feeders

MSD Dry Cabinets
Electronics Equipment Consignment

Outstanding liquid dispensing and UV curing, all within one platform, watch the video.
Voidless Reflow Soldering

One-stop Platform For All Your Need For SMT - QYSMT