New SMT Equipment: lga warpage (2)

BGA Rework Services

BGA Rework Services

New Equipment | Rework & Repair Services

Process Sciences specializes in the rework of BGA, LGA and QFN devices, BGA connectors, and various styles of bottom terminated SMDs. Driven by customer demands in the early 1990's, PSI developed custom convection air rework solutions for BGA dev

Process Sciences, Inc.

X-ray Inline Automatic Inspection Machine LX9200

X-ray Inline Automatic Inspection Machine LX9200

New Equipment | Inspection

Application Field SMT/PCBA Package type:BGA、LGA、CSP、POP、SIP... Defect type:Void、HIP、Insufficient、Bridge... Semiconductor Package type:W/B、IC、F/C... Defect type:Void、Open、Short、Sweep、Solder ball... Other areas

Unicomp Technology Co., Ltd

Electronics Forum: lga warpage (3)

Open board SiP PCB warpage measurement

Electronics Forum | Tue May 21 15:37:36 EDT 2013 | armelinda

I am looking for a service providing non contact PCB flatness measurement for open board SiP assembly. It was returned for failure analysis with complaint that assembly does not solder properly onto customer system board. Since there are remnants o

Land Grid Array soldering

Electronics Forum | Thu Apr 14 13:24:18 EDT 2016 | davef

I doubt that your problem is driven primarily by irregularities in your circuit board. My bet is that you’re seeing defects caused primarily by the warpage in your LGA. Consider using advice often given for minimizing warpage caused defects in BGA

Industry News: lga warpage (19)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2017 in San Diego

Industry News | 2016-09-22 17:27:09.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 15, 2017, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Industry News | 2017-09-19 17:02:13.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

Express Newsletter: lga warpage (57)


lga warpage searches for Companies, Equipment, Machines, Suppliers & Information

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convection smt reflow ovens

Software for SMT placement & AOI - Free Download.
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Best Reflow Oven
Selective soldering solutions with Jade soldering machine

Wave Soldering 101 Training Course
Pillarhouse USA for Selective Soldering Needs

High Throughput Reflow Oven