Electronics Forum | Wed Mar 14 02:04:40 EST 2001 | pjc
zam, each paste mfg. has different "stencil life" times. check w/ your paste mfg's specification for stencil life. also, temp and humidity inside the printer's chamber effects "stencil life" time. we keep ours around 20C @ 50% RH. higher temps and l
Electronics Forum | Wed Mar 14 17:52:49 EST 2001 | davef
6 Work Life Test 6.1 Obtain a stencil with 15 to 20 rows of a series of 0.025 by 0.050 inch apertures spaced 0.050, 0.040, 0.025, 0.015, 0.010, 0.010, 0.025, 0.040, 0.050 inches apart. See Appendix 1. Source of supply: Metal Etching Technology.
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Industry News | 2012-01-23 14:34:39.0
JBC Tools will officially launch its new range of innovations in Booth #1303 at the upcoming IPC APEX Expo.
Technical Library | 2016-01-21 16:52:27.0
Solder paste has long been viewed as "black magic". This "black magic" can easily be dispelled through a solder paste evaluation. Unfortunately, solder paste evaluation can be a challenge for electronic assemblers. Interrupting the production schedule to perform an evaluation is usually the first hurdle. Choosing the solder paste properties to test is simple, but testing for these properties can be difficult. Special equipment or materials may be required depending upon the tests that are chosen. Once the testing is complete, how does one make the decision to choose a solder paste? Is the decision based on gut feel or hard data?This paper presents a process for evaluating solder pastes using a variety of methods. These methods are quick to run and are challenging, revealing the strengths and weaknesses of solder pastes. Methods detailed in this paper include: print volume, stencil life, response to pause, open time, tack force over time, wetting, solder balling, graping, voiding, accelerated aging, and others.
Technical Library | 2018-10-03 20:41:44.0
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to "Fill the Void." This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding.
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| https://www.smtfactory.com/What-is-the-parameter-debugging-skills-of-the-Full-auto-SMT-Stencil-Printer-id3338478.html
. At present, the maximum squeegee lengths available for the general Full-auto SMT Stencil Printer are 150mm/200mm/320mm. In order to increase the service life of the stencil and squeegee of the automatic solder paste printer, the squeegee pressure is lowered
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
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