Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
Fast Smart Modular Mounter RS-1R standard 150mm conveyor extensions, 250mm conveyor extensions, upstream and downstream upstream and downstream Board siz
Electronics Forum | Fri Jun 17 10:59:22 EDT 2011 | beta
yes there is - I think it is called front print limit & rear print limit
Electronics Forum | Sun May 20 01:37:58 EDT 2012 | vileo72
Hi , Thanks for the link and could understand the limit setting . Regards Vikas
Used SMT Equipment | SMT Equipment
mind vision camera, 0603 - more than 31 type components, 45 mm long connector (L100mm x W45mm) - - more than 45 type vision camera Substrate size: (limited to the host) : L460 x W440mm (Max) ~ L50 x W50mm (Min) Substrate thickness/substrate weight:
Used SMT Equipment | SMT Equipment
mind vision camera, 0603 - more than 31 type components, 45 mm long connector (L100mm x W45mm) - - more than 45 type vision camera Substrate size: (limited to the host) : L460 x W440mm (Max) ~ L50 x W50mm (Min) Substrate thickness/substrate weight:
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Parts & Supplies | Pick and Place/Feeders
KHY-M652L-00 SENSOR,POS 1 YG12 LIMIT POSITION OF THE LIGHT FLUX SENSOR KHM-M654B-01 SENSOR,FIBER 1 YS24 TRACK OPTICAL FIBER SENSOR KHM-M654C-01 SENSOR,FIBER 2 YS12 TRACK OPTICAL FIBER SENSOR KHM-M654B-010 SENSOR,FIBER 1 KHM-M654C-012
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Parts & Supplies | Screen Printers
Product Name: P0183; MPM proximity limit switch sensors Part Number: P0183; SWITCH, PROXIMITY Description: P0183 SWITCH, PROXIMITY MPM proximity switch; limit switch sensors Applicable models: AP UP series printers P0183 SWITCH, PROXIMITY M
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-06-12 10:33:58.0
The success of ball grid array (BGA) placement on electronic assemblies is as much a matter of proper preparation and planning, as it is technique. In some designs, it is more appropriate to apply BGAs using a rework station that isolates the placement of the device, without subjecting the entire assembly to thermal reflow. This is especially beneficial in board constructions where the number of BGAs is limited, and the application of the solder paste is difficult, due to small pitch features that stretch the limitation of the stencil construction. Another application for rework stations, involves very large and thermally conductive BGAs, which will not uniformly reflow with other components on the assembly, and may require special process parameters for their proper placement. The most common use of BGA rework stations are for assemblies requiring BGA removal and replacements due to failures in the initial assembly stage.
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
00364847S01 Toothed Belt Synchroflex 2,5T5/1160 00364861-02 STOP RIGHT SIDE 1 00364867-01 Guide rail, right-hand side, laser 00364880-01 Cable cover bracket 85 00364926-01 Add.Package, Modular Headboard 00364927-01 REPAIR KIT FOR HEAD PCB MODULA
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Jan 29 00:00:00 EST 2024 - Thu Feb 01 00:00:00 EST 2024 | Big Island, Hawaii USA
Pan Pacific Strategic Electronics Symposium
Events Calendar | Thu Apr 22 00:00:00 EDT 2021 - Thu Apr 22 00:00:00 EDT 2021 | ,
Atlanta Chapter: Tech-Day
Career Center | lagos, Nigeria | Engineering
CHEVRON OIL AND GAS LIMITED NO 8 MACARTH STREET VICTORIA ISLAND LAGOS/NIGERIA CHEVRON OIL AND GAS LIMITED intends to Invite experienced and reputable persons having prime experience and capable of providing services of CHEVRON OIL AND GAS LIMITED
Career Center | Tokyo, Japan | Sales/Marketing
1. good experience in SMT industry. Especially for soldering process. 2. Speak Japanese fluently is necessary, can speak english fluently or speak Chinese. 3. familiar with Japan automotive industry.
Career Center | chennai, India | Quality Control
3 years experience in production department and 1.5 years in Quality department. and also knowledge in SAP. In Quality department, line inspection, incoming quality and final inspection are inspect and measured by vernier, Micrometer. and maintain by
Career Center | FARIDABAD, HARYANA India | Engineering,Maintenance,Management,Production,Quality Control
SMT Maintenance ( Samsung Techwin Screen Printers, Solder Paste Inspection, Panasonic & Fuji Chip Mounters & Multi Mounters, Heller Reflow Machines, Functional Testing Inline Machines, Epoxy Dispensors, Underfill Reflow, Routers) Industrial Enginee
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/1467.html
: Inrush current limiter BRW3TG31033-01 Inrush current limiter BRW3TG31033-01 PREVIOUS： 00341780S07 NEXT： 00341861S01 RELATED PRODUCTS CATEGORIES ABOUT US
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=AMETHERM&PN=MS15+40004
: Through-hole Logical Description: Inrush Current Limiter, 40 Ohm, 25%, 4.1A, 17mm ORDER NOW! This part must be ordered - turnaround is typically 1 business day. Manufacturer: Part Number: Case Code: Datasheet: Footprint Name
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