New Equipment | Component Counters / SMD Counters
I.C.T X-Ray Component Counting Machine | I.C.T Group www.smt11.com www.smtfactory.com Full SMT Factory Solution Partner I.C.T X-Ray Component Counting Machine Introduce: I.C.T X-Ray component counter uses X-ray imaging technology, applies AI algo
253.jpg)
New Equipment | Cleaning Agents
Unik You unik@cambia.cn +86 18030205725 The Universal Analog Input module supports up to 8 user-configurable inputs on a per point basis for thermocouple, RTD, Resistance, V, mV, mA or slidewire. Point-to-point isolation and back-plane
Electronics Forum | Mon Oct 03 10:41:57 EDT 2011 | patrickbruneel
Some of us here attended the 5th CALCE international symposium on tin whiskers http://www.calce.umd.edu/symposiums/ISTW2011.htm where one of my former professors, Dr. Henning Leidecker, talked about the tin whiskers he and the others at NASA Godda
Electronics Forum | Mon Jul 30 17:31:59 EDT 2018 | dekhead
That error message is keyed by a hardware (soldered) link on the backplane board of the Y1 (motor controls), through direct cable to PCIB40#3... check connections both ehds; possibility of multiple PCIB failures?
Used SMT Equipment | In-Circuit Testers
Fluke Networks DTX-1800 Fluke Networks DTX-1800 Cable Analyzer It all starts with 9-second Cat 6 Auto test that means you can meet TIA-568-B certification requirements and receive structured cabling warranties much faster than ever before. With all
Used SMT Equipment | In-Circuit Testers
Fluke Networks DTX-1800 Fluke Networks DTX-1800 Cable Analyzer It all starts with 9-second Cat 6 Auto test that means you can meet TIA-568-B certification requirements and receive structured cabling warranties much faster than ever before. With
Industry News | 2003-05-02 08:01:53.0
Flexstrip cable jumpers provide multiconductor board-to-board connection without wire stripping, cutting to length or solder preparation.
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Technical Library | 2015-02-12 16:57:56.0
Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures.The aim of this study is to investigate the mechanical integrity of lead-free ball grid array (BGA) solder joints subjected to isothermal ageing at 150°C for up to 1000 hours. Upon ageing at 150°C the Sn-3.5Ag solder alloy initially age-softened for up to 200 hours. This behaviour was linked to the coarsening of grains. When aged beyond 200 hours the shear strength was found to increase up to 400 hours. This age-hardening was correlated with precipitation of hard Ag3Sn particles in Sn matrix. Further ageing resulted in gradual decrease in shear strength. This can be explained as the combined effect of precipitation coarsening and growth of intermetallic layer. The fractured surfaces of the broken solder balls were also investigated under a Scanning Electron Microscope. The shear failures were generally due to ductile fractures in bulk solders irrespective of the ageing time.
Technical Library | 2021-07-27 14:54:26.0
Fast forward to current time. Today, our society embraces cleanliness. We expect, demand, and evaluate cleanliness in almost every aspect of our lives. We wash our cars and pets. We maintain high cleanliness standards in our hotels and public spaces. We require cleanliness in our restaurants and hospitals. We sanitize our hands throughout the day to prevent illness. We live in a clean-centric culture. While we drive clean cars, stay in clean hotels and eat clean food, there is one part of our life where we actually abandoned cleanliness. Many of the circuit assemblies that affect almost every aspect of our daily lives are no longer required to be clean. Even though our life experience confirms the link between cleanliness and reliability, happiness, health, and safety, circuit assemblies no longer maintain that "cleanliness is next to Godliness" status. This was not always the case. There was a time when virtually all circuit assemblies were cleaned. The removal of flux and other process-related contamination was commonplace. Cleaning was as normal as soldering. As we bring history into current time, one may relate the fall of Rome and its adoption of personal hygiene and the subsequent decline in human health to the large-scale abandonment of cleanliness expectations of circuit assemblies and the subsequent reliability issues it has created. How did this happen? Has history repeated itself?
link: https://www.ascen.ltd/Products/conformal_coating_equipment/ ASCEN designs and manufacturers pcb conformal coating machine for the printed circuit board industry.surface conformal coating equipment include selective coating,brush coating, aeroso
Up to 90 Percent Less Material Waste per Cartridge Change Scheugenpflug has further developed the proven material feeding unit for dispensing applications with high viscosity materials and low media consumption: The new A90 CV not only ensures a pro
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Apr 22 00:00:00 EDT 2021 - Thu Apr 22 00:00:00 EDT 2021 | ,
Ohio Chapter Meeting: Industry 4.0 / Non-Destructive Failure Analysis
Events Calendar | Wed Mar 13 00:00:00 EDT 2024 - Wed Mar 13 00:00:00 EDT 2024 | ,
Wine Down Wednesday: A Texpat Down Under- The Good, the Quirky, & the Utterly Ridiculous
Career Center | , Portugal | Engineering,Maintenance,Production,Quality Control,Technical Support
SMT Process engineer Quality Efficiency Continuous improvement 11 years of experience in high volume production in a Japanese corporation Expertise in: Solder paste printing (DEK, Panasonic) Adhesive dispensing (FUJI, Panasonic) Components Pick and p
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/workshops.cfm
. It is the role of the Failure Analysis team to establish the link between the failure mode and the failure mechanism. Once that link is understood, the path to the solution and the responsible party for it becomes clear
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/2375.html
: Material for Failure Analysis, English Material for Failure Analysis, English PREVIOUS： 00384697-01 NEXT： 00384820-01 RELATED PRODUCTS CATEGORIES ABOUT US
