25 Sealants LOCTITE 5210 One-component ultra fast curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework applic
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
M612 SMT LED pick and place machine Feature: Equipped with a function to automatically align the pickup position between feeders to improve the simultaneous pickup rate. Able to set various part supply speeds to
| 1 |
