Water-based cleaning agent for SMT stencil printer underside wipe systems VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printer
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
The Marconi (also sold as Aeroflex-IFR) 2041 Low Noise Generator has a frequency range of 10 kHz to 2.7 GHz. with a choice of operating modes, two low noise modes for improved SSB phase noise. The 2041 features excellent Spectral Purity a large displ
Marconi 2041 The Marconi (also sold as Aeroflex-IFR) 2041 Low Noise Generator has a frequency range of 10 kHz to 2.7 GHz. with a choice of operating modes, two low noise modes for improved SSB phase noise. The 2041 features excellent Spectral Pur
Industry News | 2012-10-31 20:34:37.0
ZESTRON, is pleased to announce the release of the fall 2012 edition of the ZESTRON News. This edition features a technical report on HYDRON® WS 325 and two case studies.
Industry News | 2014-11-12 17:41:45.0
ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry, is pleased to announce that Jigar Patel, M.S.Chem.Eng., Senior Process Engineer, ZESTRON, will present “Challenges and Solutions for the Effective Removal of OA Flux Residues” at the High-Reliability Cleaning and Conformal Coating Conference sponsored by IPC and SMTA. This event will be held from November 18th to November 20th at the Chicago Marriott Schaumburg in Schaumburg, IL.
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
High Temperature Masking dots High temperature masking tape and dots are ideal for masking gold fingers of printed circuit boards during wave solder or solder dip process, as well as for solder wave masking and electrical insulation. The p
Technical Library | 2016-02-25 16:26:25.0
With regard to precision cleaning applications within electronics manufacturing, pH neutral product development was a major breakthrough in recent years. The impetus for this development resulted from changes with regard to solder paste formulations and resulting assembly processes.The greater use of lead-free solder paste and the required higher reflow profiles have resulted in even more difficult to remove burnt-in flux residues. Coupled with increases in component density, larger component packages, higher lead counts, finer lead spacing, and lower standoff distances, effective cleaning is greatly challenged. The aqueous alkaline based cleaning agents can effectively remove these flux residues, however, the process often requires an increase in wash temperature and exposure time, chemical concentration, and mechanical energy. Although an efficient and effective cleaning process can be developed, oftentimes, the required operating parameters present a new set of challenges with regard to material compatibility.Since their introduction, the newly developed pH neutral formulations have proven to be capable not only of removing these difficult post reflow residues from complex board geometries, but do so without affecting material compatibility of sensitive components. Additionally, they perform at low concentration levels. This study reviews the performance of pH neutral cleaning agents as compared to alkaline cleaning agent alternatives and includes field data demonstrating their effectiveness with regard to material compatibility and cleaning performance.
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
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Defluxing of Copper Pillar Bumped Flip-Chips April 26th
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Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
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. Therefore, flux activity is identified by the absence or presence of halide (0 or 1) and also by the activity of the flux residue as represented by letters: L=low, M=moderate, H=high. “No-clean