Industry Directory | Manufacturer
Since 1971, Eagle Electronics Inc. has provided our Customers with the highest quality Printed Circuit Boards at fair and competitive prices.
New Equipment | Solder Paste Stencils
SolderMask Services - Stencils and Custom Stencils Since 1994, SolderMask, Inc. has fabricated solder paste stencil using a photo-chemical etching process. In 1998, we installed our first laser to cut the apertures of the solder paste stencil. Now,
New Equipment | Fabrication Services
Multilayer PCB's ACI manufactures a wide variety of Multilayer PCB's for various applications spanning numerous industries and technologies. We can build your high layer count PCB's using a wide variety of high speed low loss materials from epoxies
Electronics Forum | Fri May 07 16:28:07 EDT 1999 | Andrew Wulff
On 1.27mm (0.050 inches) Standard Ball Grid Array's. The ball size diameter starts at approximately 0.025 inches. If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? This is a known L
Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon
| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2008-10-29 16:47:50.0
Greeley, CO � October 2008 � Florida CirTech Inc., a leading chemical blender to the Printed Circuit and Electronic Assembly industry, announces that Genesis Materials Technology (GMT) has recently dramatically improved the ENIG resistance of Florida CirTech's water-based AQ2000 LPI solder mask. AQ2000 LPI is now able to withstand the harsh chemical conditions found in the ENIG process.
Technical Library | 2016-09-08 16:27:49.0
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.
Surface Mount Technology Association (SMTA) | https://www.smta.org/directory/suppliers.html
PDR Rework and Test Systems Shingle Springs, CA Peters Research GmbH & Co. KG Kempen, Germany PFC Flexible Circuits Ltd. Scarborough, ON, Canada Photo Etch Technology, Inc. Lowell, MA Pillarhouse USA, Inc. Elk Grove, IL
