Electronics Forum | Fri Jun 20 12:44:18 EDT 2003 | sasha
We had this problem with 0805 0.1 mF also. This problem was only with this capacitor. We have replaced all these capacitor after the ninth occurrence. My opinion - it is a defect of the manufacturer. Please inform the manufacturer of your capacitor.
Electronics Forum | Tue Apr 05 08:37:16 EDT 2016 | duoman
I'm normally running 8 hours a day M-F, and an infrequent Saturday. My nozzles are from Pentagon EMS.
Electronics Forum | Mon Apr 19 01:36:55 EDT 2010 | jola
Been a while since I used those machines but I found a list on how it was on ours anyway: MV2-F,C: F8-F1-F7-SHIFT-M-V MPA-V: F8-F1-F7-SHIFT-M-P-SHIFT-A-SHIFT-V MPA-G1: F8-F4-F7-SHIFT-M-F7-P-F7-SHIFT-A-F7 Always start from the main "run" screen. Go
Electronics Forum | Fri Oct 22 03:23:37 EDT 1999 | Brian
I agree with John, but Manko has also published 'Soldering Handbook for Printed Circuits and Surface Mounting' (van Nostrand Reinhold, a little more practical and less strong on the theory of his classic one, which is beginning to date (1st published
Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Mon Mar 08 04:51:43 EST 1999 | John Godfrey
| We are currently looking into purchasing a high volume, medium mix production line. We are considering several different vendors and I would like to know if current users of Siemens equipment are happy. Are the machines maintenance intensive? Ho
Electronics Forum | Tue Mar 16 15:43:11 EST 1999 | Mike Greening
| | We are currently looking into purchasing a high volume, medium mix production line. We are considering several different vendors and I would like to know if current users of Siemens equipment are happy. Are the machines maintenance intensive?
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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