Technical Library: manncorp and user and group (Page 1 of 1)

High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project

Technical Library | 2019-02-06 22:02:08.0

The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods, with a focus on the methods used for speeds above 2 GHz. A comparison of test methods from 1 to 2 GHz through to higher test frequencies was desired, testing a variety of laminate materials (standard volume production with UL approval, low loss, and "halogen-free" laminate materials). Variations in the test board material resin content/construction and copper foil surface roughness/type were minimized. Problems with Dk/Df and loss test methods and discrepancies in results are identified, as well as possible correlations or relationships among these higher speed test methods.

Oracle Corporation

High Frequency DK and DF Test Methods Comparison High Density Packaging User Group (HDP) Project

Technical Library | 2016-03-24 17:37:09.0

Today's Electronic Industry is changing at a high pace. The root causes are manifold. So world population is growing up to eight billions and gives new challenges in terms of urbanization, mobility and connectivity. Consequently, there will raise up a lot of new business models for the electronic industry. Connectivity will take a large influence on our lives. Concepts like Industry 4.0, internet of things, M2M communication, smart homes or communication in or to cars are growing up. All these applications are based on the same demanding requirement – a high amount of data and increased data transfer rate. These arguments bring up large challenges to the Printed Circuit Board (PCB) design and manufacturing.This paper investigates the impact of different PCB manufacturing technologies and their relation to their high frequency behavior. In the course of the paper a brief overview of PCB manufacturing capabilities is be presented. Moreover, signal losses in terms of frequency, design, manufacturing processes, and substrate materials are investigated. The aim of this paper is, to develop a concept to use materials in combination with optimized PCB manufacturing processes, which allows a significant reduction of losses and increased signal quality.

Alcatel-Lucent

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manncorp and user and group searches for Companies, Equipment, Machines, Suppliers & Information

The Branford Group
The Branford Group

A global industrial auction and valuation business with extensive experience in SMT, PCB Assembly & Manufacturing, Test, Semiconductor and other Electronics Machinery & Equipment.

Manufacturer / Equipment Dealer / Broker / Auctions

896 Main Street
Branford, CT USA

Phone: 203-488-7020

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Thermal Transfer Materials.