Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
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Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. Klein Wassink, Philips CFT, Holland "The Use of Nitrogen in Reflow Soldering" 1992: John Maxwell, JMA, Colorado "PC Board Design Techniques for Subminiature Chips" 1991: Dr
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Klein Wassink, Soldering in Electronics, A Comprehensive Treatise on Soldering Technology for Surface Mounting and Through-Hole Techniques, 2nd Edition, Electrochemical Publications, Great Britain, 310- 311, 1984. [3] Raiyo F. Aspandiar, “Voids in Solder
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