Wiring Harnesses Complete wire preparation, cable and harness assemblies Wire processing (cutting, stripping, terminating, and mass terminating Wire coding (hot stamping, Brady marking, striping, dyeing, and computer labeling) Cut and strip w
Electronics Forum | Mon May 05 22:24:17 EDT 2003 | jlipton
We are investigating a system, using 2-D matrix code, that will identify and track every PCB throughout our factory, starting from bare board. As a low-medium volume manufacturer, would labels or laser marking be more cost-effective? How difficult is
Electronics Forum | Tue May 06 09:38:41 EDT 2003 | blnorman
We use both labels and lasers to mark our boards. Since implementing the lasers, the downtime attributed to bar code labels on those lines have dropped to virtually nothing. We still have problems with the labels wrinkling during reflow making read
Industry News | 2019-08-19 22:58:44.0
Seika will showcase a complete line up of leading-edge equipment in Booth #410 at SMTA International. Products includes the latest models from McDry, Sayaka, SAWA, Unitech and MALCOM.
Industry News | 2010-04-10 02:05:54.0
IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 1999-05-07 10:13:38.0
This paper will review the device physics governing the operation of the industry standard ETOX™ flash memory cell and show how it is ideally suited for multiple bit per cell storage, through its storage of electrons on an electrically isolated floating gate and through its direct access to the memory cell.
INSIGNUM PCB Marking and Reading Systems - Southwest Systems Technology Search Search Electronics Assembly Manufacturing and Semiconductor Manufacturing Materials
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