Technical Library: marking and code and sot-23 (Page 1 of 1)

Assembly and Reliability of 1704 I/O FCBGA and FPBGAs

Technical Library | 2013-03-14 17:19:28.0

Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.

Jet Propulsion Laboratory

Intel StrataFlash™ Memory Development and Implementation

Technical Library | 1999-05-07 10:13:38.0

This paper will review the device physics governing the operation of the industry standard ETOX™ flash memory cell and show how it is ideally suited for multiple bit per cell storage, through its storage of electrons on an electrically isolated floating gate and through its direct access to the memory cell.

Intel Corporation

Counterfeit Integrated Circuits: Detection, Avoidance, and the Challenges Ahead.

Technical Library | 2014-09-04 17:43:19.0

The counterfeiting of electronic components has become a major challenge in the 21st century. The electronic component supply chain has been greatly affected by widespread counterfeit incidents. A specialized service of testing, detection, and avoidance must be created to tackle the worldwide outbreak of counterfeit integrated circuits (ICs). So far, there are standards and programs in place for outlining the testing, documenting, and reporting procedures. However, there is not yet enough research addressing the detection and avoidance of such counterfeit parts. In this paper we will present, in detail, all types of counterfeits, the defects present in them, and their detection methods. We will then describe the challenges to implementing these test methods and to their effectiveness. We will present several anti-counterfeit measures to prevent this widespread counterfeiting, and we also consider the effectiveness and limitations of these anti-counterfeiting techniques.

Honeywell International

Parallel SmartSpice: Fast and Accurate Circuit Simulation Finally Available

Technical Library | 1999-07-20 10:35:30.0

Circuit simulation is a necessary everyday tool to circuit designers who need to constantly verify and debug their circuits during the design process. As engineers face larger, more complex designs and tighter project schedules, fast SPICE simulation with no loss in accuracy has become a necessity. Simulation indeed accounts for a large portion of the time spent in the design and optimization of a new circuit...

Silvaco

Screen and Stencil Printing Processes for Wafer Backside Coating

Technical Library | 2009-09-09 15:08:19.0

Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers.

ASM Assembly Systems (DEK)

Nike's Software Architecture and Infrastructure: Enabling Integrated Solutions for Gigahertz Designs

Technical Library | 1999-05-06 14:03:04.0

This paper describes how Nike’s innovative architecture addresses the expanding requirements of Intel’s next-generation processor designs while enabling a design environment that is more productive than one built with the previous tool generation.

Intel Corporation

Digital manufacturing for traceability: The way to higher product quality and better warranty management

Technical Library | 2010-08-26 21:06:17.0

Driven by high-profile regulations compliance like the TREAD Act, warranty management has become a hot topic across industries worldwide. Recalls are costly and time-consuming events that should be avoided entirely. But without adequate process traceability and product genealogy, too many customers will get defective products and too many products will be recalled for repair or replacement even though they are not defective. Both scenarios have enormous implications for the quality-conscious manufacturer that gets rated on the number of recalls it performs - not to mention the enormous direct costs. The core issue is visibility into product quality.

ASM Assembly Systems GmbH & Co. KG

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

Technical Library | 2010-09-16 18:45:06.0

With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and de

Nordson DAGE

The Effects of Ergonomic Stressors on Process Tool Maintenance and Utilization

Technical Library | 1999-08-05 10:57:54.0

This study examines ergonomic stressors associated with front-end process tool maintenance, relates them to decreased machine utilization, and proposes solution strategies to reduce their negative impact on productivity.

SEMATECH

Managing the transition on a global scale -- changing the cleaning agent means changes to equipment, processes, process control specifications and standards.

Technical Library | 1999-05-09 12:36:40.0

The production of electronics began with hand soldering, followed by manual cleaning, which reached its peak during the NASA program. Each step in the process tended to be considered on a stand alone basis, without thought being given to the preceding and following steps. Since each step had its own set of specifications, this led to a "patchwork" approach to overall quality.

DuPont

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