Industry Directory: matrix tray size (11)

International Marketing Corporation

Industry Directory | Distributor

Representing Foreign Principals for their range of SMT / PCB Assembly equipments.

Guanjing Electronic Materials Hongkong Co,. Ltd

Industry Directory | Manufacturer

Guanjing is a major recycler of semiconductor trays used for the packing of surface-mount ICs (integrated circuits). These trays are known by various names, such as matrix trays, EIAJ trays, semiconductor trays, IC trays and JEDE

New SMT Equipment: matrix tray size (1199)

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

JUKI Fast Smart Modular Mounter RS-7R

JUKI Fast Smart Modular Mounter RS-7R

New Equipment |  

Fast Smart Modular Mounter RS-1R standard 150mm conveyor extensions, 250mm conveyor extensions,  upstream and downstream upstream and downstream Board siz

KingFei SMT Tech

Electronics Forum: matrix tray size (215)

Mydata's handling matrix trays ?

Electronics Forum | Fri Apr 15 08:23:14 EDT 2005 | cyber_wolf

We are seeing more and more jobs come in with matrix tray parts for our mydata machines. The problem is that the largest Y wagon will only hold 3 or less trays. We have some jobs that have 10+ trays. Currently our operators cut the trays down to sma

Tray size

Electronics Forum | Fri Apr 12 17:10:41 EDT 2002 | davef

Consider: * Finding JEDEC [ http://www.eia.org/jedec/ ] publication that includes matrix trays is: �JEDEC Publication No.95 Registered and Standard Outlines for Solid State and Related Products�. * Contacting tray manufacturers [ie, Peak, Summit, Nep

Used SMT Equipment: matrix tray size (293)

Essemtec FLX2011 LCV

Essemtec FLX2011 LCV

Used SMT Equipment | Pick and Place/Feeders

SMT Placement Machine Note: This lot also contains the following SMT Feeders: (6) Model 950 (8mm); (1) Model 951 (Mix) (1) Model 952 (Mix); (1) Model 953 (Mix) (2) Model 957 (Mix); (1) Model 958 (Mix) (1) Model 945-24i (24mm); (2) Model 960 (Vib

Baja Bid

Fuji QP242E

Fuji QP242E

Used SMT Equipment | SMT Equipment

FUJI, Modular Pick&Place Machine,with unique logic module QP242E-ICM-101, 5 modules total, with 4 feeders support, 31 slots/each, 1 trays slot for 20 related plate, for both electronic or mechanic feeders, 48.618 working hours, software version 3

Baja Bid

Industry News: matrix tray size (329)

Whizz Systems, Inc. Increases Production with Juki Storage Towers

Industry News | 2019-03-03 19:17:17.0

Whizz Systems, Inc. is pleased to announce that it has improved operational technology and increased production by implementing an automated warehouse system supplied by Juki Automation Systems. The automated warehouse, consisting of eight ISM 2000 Fortresses and an ISM 500 Intelligent Storage System, replaces Whizz’s warehouse consisting of shelving and racks while reducing the amount of space required.

Whizz Systems

SMT mounter Feeder common types and classification from KINGSUN

Industry News | 2023-08-17 14:26:37.0

Today, KINGSUN shares with you the common types and classifications of SMT mounters.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Parts & Supplies: matrix tray size (184)

Juki  KE-750 matrix tray holder

Juki KE-750 matrix tray holder

Parts & Supplies | SMT Equipment

Juki KE-750 matrix tray holder small size is  330x310mm  /  big size is  680x310mm.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki KE-750 matrix tray holder

Juki KE-750 matrix tray holder

Parts & Supplies | Pick and Place/Feeders

Juki KE-750 matrix tray holder small size is  330x310mm  ,   big size is  680x310mm. All the SMT parts/Priners/ESD products/Feeder carts /Tray etc. Can be customized according to customer demand size Pls kindly contact with us at any time, if ne

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: matrix tray size (2)

Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs

Technical Library | 2020-08-27 01:22:45.0

Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.

Teledyne DALSA

An Automatic Surface Defect Inspection System for Automobiles Using Machine Vision Methods

Technical Library | 2020-08-27 01:15:10.0

Automobile surface defects like scratches or dents occur during the process of manufacturing and cross-border transportation. This will affect consumers' first impression and the service life of the car itself. In most worldwide automobile industries, the inspection process is mainly performed by human vision, which is unstable and insufficient. The combination of artificial intelligence and the automobile industry shows promise nowadays. However, it is a challenge to inspect such defects in a computer system because of imbalanced illumination, specular highlight reflection, various reflection modes and limited defect features. This paper presents the design and implementation of a novel automatic inspection system (AIS) for automobile surface defects which are the located in or close to style lines, edges and handles. The system consists of image acquisition and image processing devices, operating in a closed environment and noncontact way with four LED light sources. Specifically, we use five plane-array Charge Coupled Device (CCD) cameras to collect images of the five sides of the automobile synchronously. Then the AIS extracts candidate defect regions from the vehicle body image by a multi-scale Hessian matrix fusion method. Finally, candidate defect regions are classified into pseudo-defects, dents and scratches by feature extraction (shape, size, statistics and divergence features) and a support vector machine algorithm. Experimental results demonstrate that automatic inspection system can effectively reduce false detection of pseudo-defects produced by image noise and achieve accuracies of 95.6% in dent defects and 97.1% in scratch defects, which is suitable for customs inspection of imported vehicles.

Nanjing University

Videos: matrix tray size (161)

MAX II - Heated.  Underfill with Jetting Pump NCM5000

MAX II - Heated. Underfill with Jetting Pump NCM5000

Videos

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Pcb handling equipment automatic pcb loader machine smt magazine loader 1-4 Step pitches pcb tray loader unloader

Pcb handling equipment automatic pcb loader machine smt magazine loader 1-4 Step pitches pcb tray loader unloader

Videos

Attractive price smt multi magazine loader with CE certificate APPLICATION: The Single magazine loader is used at the starting of the line for loading of PCB’s to the production line. The unit loads the production line automatically by pushing PCB’

Shenzhen Honreal Technology Co.,Ltd

Career Center - Jobs: matrix tray size (1)

Sales Manager

Career Center | Garland, Texas USA | Sales/Marketing

Electronics Manufacturing Company is looking for FT/PT full commission sales personnel, 25% and up commission base on value of orders ( not the bottom line). Experience on handling own sales accounts. Extra income for referrals, if you have business

1ST ARTICLE

Career Center - Resumes: matrix tray size (4)

Sr. Sales & Application Engineer- SMT Field Service Engineer

Career Center | San Pablo City, Laguna, Philippines | Engineering,Maintenance,Production,Sales/Marketing,Technical Support

Some key points you may find relevant to this job opportunity include:     Extensive experience and knowledge on Service and Technical skills by performing Set-up, Buy-off, troubleshooting of the assigned Equipments.     Provide solution to custom

SMT QUALITY ENGINEER

Career Center | INDIA, India | Engineering,Quality Control

BACHELOR OF ENGINEERING IN ELECTRICAL AND ELECTRONICS ENGINEERING EXPERIENCE IN SURFACE MOUNT MANUFACTURING TECHNOLOGY.

Express Newsletter: matrix tray size (295)

Partner Websites: matrix tray size (1303)

JUKI matrix tray holder MT03ES | QYSMT

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/mt03es-matrix-tray-holder-152408?page=27&order=name+desc

JUKI matrix tray holder MT03ES | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products matrix tray holder Public Pricelist Public Pricelist matrix tray holder

Qinyi Electronics Co.,Ltd

jedec tray size Archives - PCBASupplies

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Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

World's Best Reflow Oven Customizable for Unique Applications
SMT feeders

Stencil Printing 101 Training Course