AQUANOX® A4651US is a low pH aqueous cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. AQUANOX® A4651US will provide brilliant solder joints with no sump side additives and cleans exceptionally well on the late
RCX Series Resistors Versatile Wrap-Around Chip With resistance values from 1ohm to 1Teraohm, RCX Series resistors are ideal for a wide variety of applications. Wraparound terminations are perfect for epoxy or solder attachmen
Electronics Forum | Thu Aug 29 17:45:54 EDT 2002 | nifhail
What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont
Electronics Forum | Wed Jun 25 12:13:31 EDT 2003 | russ
A lot of it depends upon what the lead terminations are and the storage conditions. For example if they are tin you will run into trouble. We have used all types of parts that are all ages (We just started doing BGAs that are 5 years old.) I don't
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Technical Library | ACI Technologies, Inc.
Tin (Sn) metal displays the characteristic of growing “tin whiskers” from pure tin coatings (most actively on relatively thin, electrodeposited or immersion tin coatings), usually months or years from the initial deposition of the tin. Tin whiskers are electrically conductive, filamentary, single crystals of white (beta phase) tin. These filaments of single crystal tin are usually one to five microns in diameter, and a few microns up to several tens of millimeters long, that grow spontaneously from the tin coatings. Alloying additions of several percent (by weight) of lead (Pb) prevents these electrically conductive tin whiskers from growing. Pb alloyed into the Sn was discovered to prevent the occurrence of tin whiskers in electronic assemblies in the 1950s as the Bell Laboratories solution to the problem of tin whiskers. The alloying of the tin with lead has thus quietly averted incalculable losses from short circuits in electronic equipment for the last 60 years.
Technical Library | 2020-07-01 19:45:04.0
A company approached ACI Technologies (ACI) for assistance with a new product that was about to undergo its initial proof-of-concept prototype build. This product was an item that was being furnished to the Department of Defense for a program designed to increase the technical capabilities of computer equipment issued to the war fighter. The requirements for this item specified the use of tin-lead solder during assembly of production units. One of the main responsibilities for ACI during this project was to assist the client in mitigating the risk introduced using commercial off-the-shelf materials that may be lead-free.
BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
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