Industry Directory: max (23)

Max Top Company

Industry Directory |

Solder Wire, Solder Bar, Solder Paste, Solder Ball

SeMax Wireless, Inc

Industry Directory |

SeMax Wireless, Inc. designs & manufactures leading edge, 800/1900MHz, CDMA wireless communication devices. Visit our site, www.semaxwireless.com and see some of our existing OEM products and capabilities. Applications include: AVL, Security System Monitoring, Automatic Meter Reading & Remote Equipment Sensing.

New SMT Equipment: max (22070)

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Electronics Forum: max (736)

Recommended max board temp for BGA repair

Electronics Forum | Wed Aug 10 16:04:09 EDT 2005 | rrylande

I am concerned about delamination and other modes of damaging the board itself. Am I mistaken to believe that raising the entire board to near reflow temperatures (during the repair of a single BGA) may damage the quality of the board?

Recommended max board temp for BGA repair

Electronics Forum | Wed Aug 10 17:02:32 EDT 2005 | Inds

wats the thickness of your board.. and the dimension.. I would not heat the board beyond 150deg C.. coz if the board is thick and large.. it will take a long time to reach that temp..and you will burn off your flux.causing poor solder joint. Ind

Used SMT Equipment: max (1115)

Tyco 158390-I-V

Tyco 158390-I-V

Used SMT Equipment | Circuit Board Assembly Products

2008 Tyco 1583900-I-V Board Router Features: Smart TAG Fixturing o Program ID (once fixture is loaded) o Dust Free Environment o 20" x 18" Max Panel Size o 1" Max Top Side Component Height o 2" Max Bottom Side Component Height o Self contained PC wi

Baja Bid

Industry News: max (152)

GPD Global's MAX Series Provides Maximum Accuracy

Industry News | 2011-04-22 21:36:56.0

GPD Global announces that its MAX Series Dispensing Systems are the dispensers of choice for high accuracy and repeatability applications.

GPD Global

GPD Global's PCD Dispensing on Its MAX Series Platform Recognized with Two 2011 Global Technology Awards

Industry News | 2011-11-20 13:36:13.0

GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform

GPD Global

Parts & Supplies: max (112)

Fuji NXT M3

Fuji NXT M3

Parts & Supplies | Pick and Place/Feeders

Device description: Machine Model: NXT-M3 Machine year: 2007 PCB Size: Minimum: 48mm X 48mm Max: 510mm X 534mm(dual track) Patch speed: H12HS: 22,500; H08:10,500; H04:6,500; H01:4,200 Paste accuracy: H12S/H08 / H04 :0.05 mm(3sigma) cpk ≥ 1.00 T

KingFei SMT Tech

Technical Library: max (1)

To Quantify a Wetting Balance Curve

Technical Library | 2017-10-19 01:17:56.0

Wetting balance testing has been an industry standard for evaluating the solderability of surface finishes on printed circuit boards (PCB) for many years. A Wetting Balance Curve showing Force as a function of Time, along with the individual data outputs "Time to Zero" T(0), "Time to Two-Thirds Maximum Force" T(2/3), and "Maximum Force" F(max) are usually used to evaluate the solderability performance of various surface finishes. While a visual interpretation of the full curve is a quick way to compare various test results, this method is subjective and does not lend itself readily to a rigorous statistical evaluation. Therefore, very often, when a statistical evaluation is desired for comparing the solderability between different surface finishes or different test conditions, one of the individual parameters is chosen for convenience. However, focusing on a single output usually doesn't provide a complete picture of the solderability of the surface finish being evaluated.In this paper, various models here-in labeled as "point" and "area" models are generated using the three most commonly evaluated individual outputs T(0), T(2/3), and F(max). These models have been studied to quantify how well each describes the full wetting balance curve. The solderability score (S-Score) with ranking from 0 to 10 were given to quantify the wetting balance curve as the result of the model study, which corresponds well with experimental results.

Enthone

Videos: max (765)

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

Videos

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

MAX II - Heated.  Underfill with Jetting Pump NCM5000

MAX II - Heated. Underfill with Jetting Pump NCM5000

Videos

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Career Center - Jobs: max (4)

Assembler

Career Center | , | 2018-02-22 12:50:43.0

Job Description: • Performs a variety of tasks ranging from repetitive to non-repetitive production assembly operations on printed circuit card assemblies. • Ability to work from diagrams and drawings, make initial layouts, and use hand and/or pow

Assembler

Career Center | , | 2018-02-22 12:51:59.0

Job Description: • Performs a variety of tasks ranging from repetitive to non-repetitive production assembly operations on printed circuit card assemblies. • Ability to work from diagrams and drawings, make initial layouts, and use hand and/or pow

Career Center - Resumes: max (7)

smt technicina

Career Center | chennai, India | Engineering,Maintenance

Nokia India Pvt LTD.       Sriperumpudur – Board Assembler Maintenance Technician  from Sep 2009 to till now. Machines Handled  Pick & Place     : FUJI NXT Machines  FUJI NXT - M3 II ,M3S.  Reflow oven: Hot flow 3/20, 2/14.  Stencil Pr

QUALITY CONTROL MANAGER

Career Center | BANGALORE, Karnataka India | Quality Control

New Model Evaluation • Testing & Evaluation of New TV models as per the relavant standards & release the defect free product for Mass Production • Measurement of audio parameters like Max out put, distotion, S/N ratio, hum, buzz etc • To conduct aud

Express Newsletter: max (174)

Partner Websites: max (3713)

MultiEx™ Humid-Max Plus

| https://www.clariant.com/pt/Solutions/Products/2019/11/04/14/01/MultiEx-HumidMax-Plus

MultiEx™ Humid-Max Plus Produtos & Negócios Sustentabilidade Company Mídia Investidores Carreiras Events Buscar Compartilhar Região Contato Fechar Fechar Buscar If you are searching for Safety Data Sheets, please visit our Document Finder Todos os resultados Fechar Facebook Twitter LinkedIn E-mail WhatsApp More Options Fechar Fechar Produtos

Nominal Epad vs Max Epad - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/nominal-epad-vs-max-epad_topic2530.html

Nominal Epad vs Max Epad - PCB Libraries Forum   Forum Home > PCB Footprint Expert > Questions & Answers    New Posts    FAQ    Search    Events    Register    Login Nominal Epad vs Max Epad

PCB Libraries, Inc.


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