The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
The ExplorFlow™ series reflow soldering systems are designed to deliver excellent thermal performance combined with process capability and control. The platforms offers a combination of industry-proven technologies in an easy to use, reliable and eff
Electronics Forum | Thu Mar 15 10:28:46 EDT 2007 | cecil
Just askin but why would someone even want to subject an assembly to even 6 reflow cycles? As far as how many cycles that an assembly can be subjected to, wouldn't that be determined my your components?
Industry News | 2011-02-05 14:02:52.0
IPC announces its Winter Webinar Series for February and March 2011. Focused on technical challenges facing the electronics manufacturing industry, including lead-free reliability issues, high voltage PCB design, package on package (PoP) assemblies, PoP component manufacturing, thermal cycle testing and barrel failures, the one-hour webinars offer companies a great opportunity to bring IPC technical information to a large number of employees at one time.
Industry News | 2021-12-23 20:23:39.0
For refrigeration products, high efficiency and energy saving are the constant pursuit and breakthrough of technology. In cooling industry, Mitsubishi Electric has been occupying a significant place. With article, we are going to talk about five advantages of refrigeration compressor of Mitsubishi Electric to allow everyone to understand the technologies of Mitsubishi, and how they have made Mitsubishi a big shot in HVAC industry worldwide.
Technical Library | 2019-12-26 19:13:52.0
Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration.In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.
Technical Library | 2018-08-29 21:17:53.0
No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed that cracks can and do form in flux residue and have postulated that this is the result of or exacerbated by temperature cycling. Furthermore, the potential exists for the flux residue to soften or liquefy at elevated temperatures, and even flow if orientated parallel to gravity. In situations such as in automotive electronics, where significant temperature cycling is a reality and high reliability is a must, concern sometimes exists that the cracking and possible softening or liquefying of the residue may have a deleterious effect on the electrical reliability of the flux residue. This paper will attempt to address this concern.
. The failure data are reported as characteristic lifetime (the number of cycles to achieve 63.2% failure) and slope from a two-parameter Weibull analysis
joint failures from the TC1 0/100 °C thermal cycling test are shown in the optical photomicrographs in Figure 12. The large solder voids reduce the effective attachment area through which the crack propagates, thereby reducing the number of cycles to