ML-HT5000C 3D online x-ray inspection equipment X-ray tube Light pipe type closed tube Light tube voltage 130KV detail resolution 3um cooling method ir coalng Geometric magnificatian 32
Soldering paste measurement and solder paste characteristic developing 3D measurement http://www.selen.hr/pokaz_kategorie.php?cid=70
Electronics Forum | Mon Jul 11 17:49:53 EDT 2016 | davef
Measurement Specialties purchased RTD Company, Inc. [ http://www.meas-spec.com/rtd-company.aspx ] in October 2012 and has maintained the primary site and staff in Minnesota. We continue to be a technological leader in the design and manufacture of e
Electronics Forum | Fri Apr 14 11:00:38 EDT 2000 | Dave F
Mario: Your ask a very broad question and give no background information. Generally, the amount and type of residues present on a printed circuit board at the very beginning of a SMT line depends on the exposure of the board up to that point. For
Used SMT Equipment | In-Circuit Testers
Advantest R3162 Base Frequency: 9 KHz Max Frequency: 3 GHz Spectrum Analyzer; 9 kHz to 8GHz The R3132/3132N/3162 are a low-cost implementation of the key performance of a portable spectrum analyzer manu-factured to address a variety of mea-surem
Used SMT Equipment | In-Circuit Testers
Agilent N9020A Standards evolve, product cycles get shorter, and each project demands tradeoffs and decisions about specs and capabilities, about throughput and yield. A highly flexible signal analyzer helps you make solid choices and keep things
Industry News | 2020-11-24 00:32:09.0
Cheersonic has committed to the research and development of various ultrasonic equipment for more than ten years. We will design a suitable plan according to the different needs of customers. CENG-S, CENG-M and CENG-L developed by our company is basic , programmable micro material spray coating system.
Industry News | 2020-11-27 02:44:38.0
Ultrasonic Spray For Electrode Coating. Maximizing the use of Electrode in the Fuel Cell by ultrasonic spray
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Parts & Supplies | Pick and Place/Feeders
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Parts & Supplies | Pick and Place/Feeders
UNIT 3 [6-E] KXFB02Q5B01 BRACKET KXFB02Q6A00 SHAFT KXFB02Q7A00 BRACKET KXFB02Q8B00 BRACKET KXFB04MCA00 PLATE KXFB02QCA00 BRACKET KXFB04MEA00 PLATE KXF0DGNAA00 LM-SHAFT KXF096CAA00 LM-BEARING KXF0DLBAA00 TUBE KXF0DLAAA00 TUBE
Technical Library | 2008-10-01 14:02:27.0
This paper proposes an integrated system for film application process than consists of closed loop mass calibration to assure film thickness, a noncontact fast jetting process with high edge definition capable of applying films for highly selective areas and patterns. A system to obtain homogeneity of the solid-fluid mix is described and results are shared.
Technical Library | 2016-11-03 17:53:56.0
We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip.In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources.
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Career Center | San Diego (Mira Mesa), California USA | Engineering
SMT MANUFACTURING (Quality) ENGINEER (Process Engineer) Duties & Responsibilities: Researches, develops and installs SMT processes and equipment necessary to produce high quality, least cost products. Responsible for the identification and elim
Blackfox Training Institute, LLC | https://www.blackfox.com/4-industries-to-apply-hmp-solder-training/
. Avionics Aircraft development always evolves together with electronics, as proven by the MEA initiative (More Electric Aircraft), which seeks to replace traditional centralized engine controllers, made up of bulky, heavy wire harnesses and complex interconnections
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/pcb-footprint-expert-2013_topic929_post3458.html
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