Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
Electronics Forum | Fri Sep 16 12:52:13 EDT 2005 | timekey
Steve- Depending on which Fuji model you have, Fuji PAM either needs to be purchased from Fuji or if you have a CP-7, CP-8 or NXT, Fuji PAM is already installed in the machine from the factory. The kit...if you are required to purchase it from Fuji i
Electronics Forum | Wed Mar 05 08:12:56 EST 2003 | nifhail
Hi Mike, How do we measure the O2 ppm in N2 environment. I don't understand why the customer keep insisting me to use N2 instead of Air. I don't see the need for it as I done have any soldering issue. Can you share with me why N2 is needed at the fi
Used SMT Equipment | Pick and Place/Feeders
Software Version 4.2.4e Electrical two-pole test Electrical transistor test Shared databases Hydra Electrical measurement Hydra high speed Line mode Fast place sequence Hydra large component range Hydra fine pitch In/Out conveyor board trai
Used SMT Equipment | General Purpose Test & Measurement
System has 6 probe heads 4 upper probe heads 2 lower probes heads Currently configured for analog testing Has SMEMA connections for loader/unloader to be attached Can be used for left to right or right to left load configuration All maintenance
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
MPM out board sensors(P2715/P7215) Name: P2715; P7215; CA-553; P1001; MPM out board sensors Part Number: P2715; P7215; CA-553; P1001 Description: P2715; P7215; CA553-4; CA553-5; CA-553; P1001 MPM and out board sensors Applicable models: AP UP P
Parts & Supplies | SMT Equipment
MPM out board sensors(P2715/P7215) Name: P2715; P7215; CA-553; P1001; MPM out board sensors Part Number: P2715; P7215; CA-553; P1001 Description: P2715; P7215; CA553-4; CA553-5; CA-553; P1001 MPM and out board sensors Applicable models: A
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2019-08-19 09:46:13.0
Boundary scan is a method for testing interconnects on printed circuit boards (PCBs) or sub-blocks inside an integrated circuit. It has rapidly become the technology of choice for building reliable high technology electronic products with a high degree of testability. Due to the low-cost and integrated circuit (IC) level access capabilities of boundary scan, its use has expanded beyond traditional board test applications into product design and service.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Events Calendar | Mon Feb 19 00:00:00 EST 2024 - Mon Feb 19 00:00:00 EST 2024 | ,
SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board
Career Center | Grand Rapids, Michigan USA | Engineering
MAIN DUTIES: Performs new process development, monitors and maintains the processes in all areas of manufacturing including, but not limited to assembly, soldering, conformal coating, prep and related equipment. Responsible for generating, i
Career Center | Eden Prairie, Minnesota USA | Engineering
Logic PD collaborates with clients to help them launch products that accelerate growth and capture value in the Internet of Things (IoT). Logic PD helps at any stage in the product lifecycle by being the complete product innovation and product realiz
Career Center | Denton, TX-Texas USA | 2017-05-06 20:13:59.0
Engineering,Production,Quality Control
Career Center | NEW DELHI, India | Technical Support
I am having almost 20 years of experience in the field of electronics repairs domestic & industrial, able to work on any circuit and PCB without any schematic or diagram. I have all the records and certifications with me and fully c
Return to Front Page OnBoard Forum Who's OnBoard?Mi
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page << Back to Page 2 Page 4 >> Cm System Measurement Principle Measurement instability
Whizz Systems | https://www.whizzsystems.com/high-end-electronics-design-for-board-and-system-level-products/
High End Electronics Design for board and System Level Products - Whizz Systems Skip to content High End Electronics Design for board and System Level Products More Videos Services
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/wafer-level-packaging-symposium-2022
Wafer-Level Packaging Symposium 2022 MARCH Products Corporate | Global Directory | Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series PCB Systems VIA High Volume Series ModVIA Expandable Plasma System Plasma Applications
