Electronics Forum | Mon Nov 05 20:34:03 EST 2001 | davef
What�s the problem? There area many heat related failure mechanisms in bare boards. You can damage boards with heat several ways. A couple favorites [Don�t try this at home. Perform on a closed track by professional solders only.] are: * Put a
Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Sat Oct 02 20:19:19 EDT 1999 | John Dwinell
| | I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Ir
Electronics Forum | Thu Jul 27 00:40:34 EDT 2006 | Habibooboola K. Halaliliaholiokeebob
I have a production defects on smt mounted spring that the designre at my compnay is try.the spring act as conduction between the resistor capacitor network and mount with the prefrom and then reflow thru the oven. the design intent for spring is mec
Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest
Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond
Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Sun Feb 06 07:49:16 EST 2000 | Dave F
Casimir: A comment and a couple questions: * Have you considered a machine that forms component leads to "self-clinch?" With this forming components snap into hole in the boards with the proper finished lead length and requires not trimming after
Electronics Forum | Thu Feb 25 18:14:46 EST 2016 | rgduval
They're open ended on the thickness (read that as, have no clue). They've indicated that they would like the coating to protect the circuitry from ESD, and mechanical shock. They also would like to be able to see the LED's through the material. An
Electronics Forum | Mon Jun 30 10:52:36 EDT 2003 | Bob
Suggest you ask vendor for a failure analysis. Ceramic chips have specific signatures for mechanical or thermal shock cracking. The vast majority of failures are due to mechanical flex. Depanelization and secondary operations such as hand insertion
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