New Equipment | Solder Materials
200oC) solders, commonly known as dross, on still pots and wave solder machines. Many competitive dross-reducing materials are based on mineral oils and fatty acid compounds that breakdown and deposit on the PCB assemblies. Super Deox #1 is a stable,
New Equipment | Rework & Repair Equipment
Qualitek's low temp. lead free soldering kits are a recommended lead free soldering alternative for heat sensitive assembly that requires a low melting point. The low melting point prevents thermal degradation of the heat sensitive components. Al
Electronics Forum | Sat Jan 19 04:50:48 EST 2019 | tirthkar8980
why two high melting temperature metals are getting melt earlier or mean at very low temperature after mixing. Ex :- Tin (sn) - 231 C melting point lead (pb) - 327 C melting point But Sn/Pb - 63/37 melting temperature is 183 C
Electronics Forum | Thu Oct 25 04:58:58 EDT 2007 | wayne_
I think the not fully melted BGA ball is the main problem. The middle of the BGA IC...the ball not fully melted....when it subjected to heat and cause PCB warpage....the partial melted joint in the middle part of the BGA started to crack...bcos of we
Used SMT Equipment | Soldering - Selective
PVA 3000 Dispenser (2012) Brand: PVA Model: 3000 Year: 2012 Serial #: W5339 Type: Dispenser Supply Voltage: 120 VAC, 60 Hz, 12 A Single phase Motion Axes: 3 Controller Axes: 4 Controller: 2000 - X-Stroke: 500mm - Y-Stroke: 500mm - Z-St
Used SMT Equipment | Soldering Equipment/Fluxes
Versaflow Selective soldering Selective Soldering Process Advantages: Better, Faster, Cleaner & Cheaper! . consistent LF solder joint quality & significant reduction of DPM . No re-melting of top side SMD components, as with wave soldering . PCB
Industry News | 2015-07-06 19:08:22.0
Seika Machinery now carries the MALCOM RDT-250C Reflow Simulator. The system can reproduce the temperature profile of a reflow oven while allowing operators to observe the melting state of solder paste and record the process.
Industry News | 2015-11-04 04:29:38.0
Nordson ASYMTEK unveils systems with new process controls and features that make fluid dispensing and conformal coating as easy as Ready, Set, Jet. See the demonstrations at Productronica, stand A2.461.
Parts & Supplies | Board Cleaners
KGT-M7730-A1X SMT pick up NOZZLE 203A ASSY for YAMAHA YG200 Smt machine Assembleon MG-I MG-8 Nozzles (Yamaha YGIOOB, YGIOOR , YG88R) O.65*0.35 for 0603 9498 396 00641 Nozzle 211A O.8*O.7 (X) 9498 395 00642 Nozzle 212A 1.7* 1.0 (X) 9498 393 00
Parts & Supplies | Component Packaging
Assembleon 5322 360 10493 PA2962-47 Nozzle 71A for Topaz-XII Assembleon Topaz-Xll, Opal-xll, Sapphire-XII Nozzles (Yamaha YVIOOX YV180X O.65*0.35 for 0603 5322 360 10493 (PA2962-47) Nozzle 71A 0.8*0.7 5322 360 10494 (PA2962-48) Nozzle 72A 1
Technical Library | 2009-07-01 09:24:25.0
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Qualitek International, Inc. presents Ecolloy the future of high performance lead free solder. Ecolloy has a higher tensile strength and temperature cycling than SAC 305 and SnCu alloys. Melting range of this new alloy is lower than SnCu alloys so it
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Mar 14 00:00:00 EDT 2018 - Wed Mar 14 00:00:00 EDT 2018 | ,
Role of Bismuth in Lead-free Electronics - SMTA Webtorial
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | , Florida USA | Engineering,Management,Quality Control,Research and Development,Technical Support
Resourceful, innovative professional with over 15 years in the Electronic Industry, with domestic and international experience. Expertise in initiating projects and programs that boost efficiency and productivity while expanding employee education.
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
SMTnet Express July 18, 2013, Subscribers: 26169, Members: Companies: 13430, Users: 34947 Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods by Fan Gao, Karunaharan Rajathurai, Qingzhou Cui, Guangwen Zhou
SMTnet Express, July 1, 2015, Subscribers: 22,969, Members: Companies: 14,445, Users: 38,464 Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi Joseph M. Juarez, Michael Robinson, Joel Heebink; Honeywell International
| http://etasmt.com/cc?ID=te_news_bulletin,18961&url=_print
. The reflow solder joint is formed by the solder paste melted in the SMT reflow oven and then cooled and solidified. The joints connected by reflow soldering are called reflow solder joints
ShenZhen J-wide Electronics Equipment Co.,Ltd | https://www.jwide-smt.com/ga/praesent-congue-nunc-id-dapibus/
. The tackiness of the paste enables the components to stay in place . A good solder joint is one where the solder paste has melted well and flowed and wetted the lead or termination on the component and the pad on the board
