Industry Directory | Manufacturer
FP Stencil Sdn. Bhd. is principally involved in the manufacture and sale of laser-cut metal surface- mount technology (SMT) stencils. Our products comprise of PCB stencils, wafer stencils, mini stencils, & accessories.
Industry Directory | Manufacturer
UWELLPCB.com is the PCB supplier. We offer PCB from single side board, double side PCB to 32layer board,including the Rigid PCB, Flex PCB, Rigid-flex PCB,Quick-turn prototype and PCB assembly
New Equipment | Education/Training
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
AMP series full automatic PCB vision measuring machine is the new launched latest upgraded products from ASCEN, which offer outstanding measuring performance. The full ULTRA series is standard with high accuracy linear slide way, which ensures m
Electronics Forum | Fri Jan 06 19:57:19 EST 2006 | abhinavajmera
What would be the most suitable expression for ratio of Volume of Alloy to Volume of Paste for a solder paste? For example if we use 63Sn/37Pb alloy with a 90 Wt% metal what would be an appopriate expression for the Volume Ratio?
Electronics Forum | Thu Mar 28 14:04:16 EST 2002 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Used SMT Equipment | In-Circuit Testers
The 5316A Universal Counter uses a unique custom circuit called the MRC (Multiple Register Counter) which packs counting and computing power into one unit. Frequency range (channel A) is 0.1Hz to 100MHz. Period range is 10 ns to 105 sec, time interva
Used SMT Equipment | In-Circuit Testers
The 5316A Universal Counter uses a unique custom circuit called the MRC (Multiple Register Counter) which packs counting and computing power into one unit. Frequency range (channel A) is 0.1Hz to 100MHz. Period range is 10 ns to 105 sec, time interva
Industry News | 2017-05-16 17:59:37.0
PCB Technology Trends 2016, a global study published this month by IPC – Association Connecting Electronics Industries®, is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2021 that will affect the whole industry.
Industry News | 2012-04-12 12:39:48.0
Flexible circuit technology is utilized in all market sectors, including military, telecommunications, medical and consumer products.
Technical Library | 2018-10-31 20:35:49.0
The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors. Copper electrolytes for high throwing power applications with high thermal reliability and high throughput are becoming extremely important for manufacturing high aspect ratio circuit boards.Here we discuss innovative DC copper metallization formulations for hoist lines and VCP (Vertical Continues Plating) applications with high thermal reliability and throughput for high aspect ratio PCB manufacturing
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
ETA Industrial Pure Water Machine ETA-DI250 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA Cleaning Machine, On-line PCBA Cleaning M
SMTnet Express, August 10, 2017, Subscribers: 30,696, Companies: 10,656, Users: 23,635 High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/industries/metal-fabrication?con=t&page=10
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| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
. This would be related to percentage flux to metal ratio content of the paste rheology. As for the solder paste not reflowing and appearing as a solder ball grain structure on the surface of the solder paste, this is due lack of enough applied heat, which will prevent the solder paste
