Industry Directory | Distributor
Methodical Purchasing, owned and operated by ASAP Semiconductor, is a leading supplier of aircraft pump and compressor parts and NSNs.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo
Electronics Forum | Tue Apr 04 02:46:39 EDT 2000 | George Verboven
We are looking for a way to cure conductive adhesive. I heard about curing times from 2 hours and more. But I also received information that curing can be done in 10 minutes at 120 C. Of course it also depends from the type of glue. But the question
Electronics Forum | Wed Apr 05 22:42:28 EDT 2000 | Dave F
George: I would think so. We use an old Vitronics (822??) IR reflow oven to clue SMT adhesives. Gp get 'em!!! Dave F
Used SMT Equipment | General Purpose Test & Measurement
Optical Spectrum Analyzer Agilent 86140B Optical Spectrum Analyzer. Passes self test - no option. Built-in test applications, 10 pm wavelength accuracy, Fast dual-sweep method, Covers S, C, and L wavelength bands. SN# US40461075 Room 4C. SN# US40461
Used SMT Equipment | SMT Equipment
Product name: YG200 yamaha SMT medium speed chip mounter Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850 conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIP conversion) 16 pinso
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Parts & Supplies | Semiconductor & Solar
Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIPconversion) 16 pinsop: 24400 CPH (0.147 SEC/SOPconversion) (Max 80 varieties
Parts & Supplies | Chipshooters / Chip Mounters
Product name: YG200 YAMAHA medium speedchip mounter Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIPconversion) 16 pinsop:
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.
The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
Events Calendar | Tue Sep 22 00:00:00 EDT 2020 - Tue Sep 22 00:00:00 EDT 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | , | Engineering
Methode Electronics, Inc. seeks Quality Engineers experienced in testing and calibration; micro-controller based electronic assemblies, SPC, DOE. Send resumes to Methode Electronics, Inc. PO Box 130, Carthage, IL 62321 or email resumes@methode-aecd.c
Career Center | chennai, India | Production
i also working in smt operator an 6 mounth.so,i am searching better for my working company.my smt knowledge is operating on printer,pick&place and also reflow and wave soldring.i am operate at full function an the smt machine and i know the all smt c
Career Center | Mayaguez, Puerto Rico | Engineering,Production
Detail oriented and goes to great lengths to insure that the products are meeting and exceeding customer expectations. Place procedures and training in place to provide former company with techniques for ISO 9001:2008 and QS 9000. Assist design engi
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völlig neuen Rolle kennen. Kaffee zubereiten in Zusammenarbeit mit einem Barista macht Spaß und beschert ein nachhaltiges Erlebnis. Gleichzeitig werden die Prinzipien und Praktiken der Projektmanagement Methode Scrum angewandt
