New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Education/Training
The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo
KINGSUN 800CS COMPUTER AIR COOLING REFLOW OVEN Model: 800CS Dimension (L * W * H) 4200*850*1350 Number of heating zones Up / Down 8 Number of cooling zones Up 1 Emission requirements 10m3 /min*2( channel ) Heating time About 15 minutes Temperature
Features of Refurbished JUKI JX-350 High Efficiency SMT Placement Machine Chip: 32,000CPH chip (Laser centering/Optimum); 21,000CPH chip (Laser centering / IPC9850). ■ From 0603 to 33.5mmsquare components. ■ JUKI laser centering for high speed,
Features of Refurbished JUKI JX-350 High Efficiency SMT Placement Machine Chip: 32,000CPH chip (Laser centering/Optimum); 21,000CPH chip (Laser centering / IPC9850). ■ From 0603 to 33.5mmsquare components. ■ JUKI laser centering for high speed,
