GS Praezisions AG is a Swiss manufacturer of flex and rigid flex circuit boards. We spezialize in miniaturization and produce chip on board and flip chip substrates with micro via in laser and plasma technology among standard multilayer HDI PCBs.
Industry Directory | Manufacturer
We specialize in manufacturing high quality HDI PCBs.We manufactured lots of high complicated HDI PCBs(3+N+3,4+N+4,5+N+5,6+N+6,7+N+7 and micro-vias for anylayer) I will be happy to show some HDI PCBs we did if you have interest.
New Equipment | Solder Paste Stencils
Lasercut LTCC-stencil (Low Temperature Cofired Ceramic) The LTCC-technology (low temperature co-fired ceramic) is used in the hybrid-technique when several interconnection levels are realized. The connections between the layers are manufactured with
A high speed micro via drilling system, the GS-600 incorporates a dual laser system for the highest throughput and hole quality. Capable of producing up to 900 holes/second, the hole diameters can range from 0.001" to 0.010". The GS-600 is compatib
Electronics Forum | Fri Apr 11 09:14:36 EDT 2003 | gdstanton
Can anyone recommend a PWB manufacturer who has demonstrated a mature micro via process? Looking for suggestions both domestically and internationally. Thanks in advance for your help. Greg
Electronics Forum | Tue Mar 24 09:26:56 EST 1998 | Jim Kittel
Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via?
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Technical Library | 2001-04-24 10:44:24.0
This paper reviews the possible implementations of the Micro Via Technology within the Mentor Graphic's Board Station environment, specifically within the Librarian, Layout and Fablink applications. In this context, the definition of a Micro Via is constrained to Board Station’s support of such technology and contains only generalized descriptions of the manufacturing processes that require Micro Vias.
Technical Library | 2013-09-19 17:25:32.0
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches, which can be used for very thin any-layer build-ups. The technological approaches are compared on reliability level – the any-layer copper filled micro-via technology which is to be considered as state of the art technology for high end phones and the ALIVH-C/G technology that is well established in Japan. A test vehicle design featuring test coupons for comprehensive reliability test series has been defined as target application for investigation...
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/torsion-testing?con=t&page=15
Reliability Investigation of Printed Circuit Board Micro-vias by X-ray Inspection Nordson DAGE Assure Series Brochure _web Nordson DAGE Nordson Test and Inspection Systems at SMT Nuremburg Nordson DAGE Live
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