Industry Directory | Manufacturer
HILEVEL Technology, Inc. is a world leader in American made low-cost IC test systems for Production, Engineering, and Failure Analysis since 1979.
Industry Directory | Distributor
Established in 2009 year, Unibetter have 217 employees,with USD28 Million Inventory, Strong Lines, ADI TI AMD/XILINX INTEL/ALTERA NXP MICROCHIP INFINEON ST RENESAS etc. we can support Shortage, BOM, PPV, EOL, Excess,Testing
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
Device control via internal JTAG access - processor and FPGA cores While many ICs are equipped with a JTAG (IEEE Std. 1149.1) boundary-scan register (BSR), a significant number of microprocessors and DSPs can be found with deficient or even non-exi
Electronics Forum | Wed May 24 17:49:51 EDT 2000 | Keith Luke
SMTneters, The end of May finds several recent publications from leading publishers on my desk. I am all too happy to share these books with our loyal SMTneters in the hopes that they will provide us with a timely review of the new release. For ma
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Industry News | 2022-03-03 16:21:56.0
During his State of the Union address tonight, U.S. President Joe Biden is expected to urge Congress to pass much-needed funding for semiconductor manufacturing and other advanced technologies as part of a new competitiveness measure. Both the House- and Senate-passed bills include $52 billion in funding as well as additional measures to boost American R&D, which will help reestablish the United States as a global leader in building the technologies of the future. IPC applauds President Biden's continued focus on the semiconductor shortage and his ongoing efforts with Congress to finalize the "USICA/America COMPETES" legislation.
Industry News | 2019-06-09 20:06:49.0
CheckSum wants the world to know that their Parallel Technology offers many advantages by testing in line as opposed to in a test cell, avoiding costly potential issues down the line.
Technical Library | 2018-04-05 10:40:43.0
The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.
ST New and Original STM32F407ZET6 in Stock LQFP-144 package ST New and Original STM32F407ZET6 in Stock LQFP-144 package ST New and Original STM32F407ZET6 in Stock LQFP-144 package TJA1040T/CM,118 NXP TJA1042TK/3/1J NXP TJA1043T,118 NXP TJA105
Demonstration of JTAG Live™ CoreCommander software. CoreCommander offers JTAG control of µprocessors, and DSPs via core debug access. The tool's routines take control of key processor core (e.g. ARM, PPC, X-scale, Cortex etc.) functions using the bui
Career Center | Chesterland, Ohio USA | Engineering
Principal Electronic Engineer IV Position Overview We currently have an excellent career opportunity for a Principal Electronic Engineer (IV) to join our engineering department team at our Channel Products, Inc. facility in Chesterland, OH. This
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
Conductive adhesives increase microchip packaging density Conductive Adhesives Increase Microchip Packaging Density Interconnecting microelectromechanical systems directly to printed circuit boards can improve reliability and reduce costs
Materials, LLC. The miniaturization of microchips is a
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, and boron nitride nanosheets. Since they’re only 1-2 nanometers thick, these materials can either be grown atop silicon microchips or they can be grown separately and carefully placed. But what can these microscopic materials accomplish? These materials
