New SMT Equipment: microvias (Page 1 of 2)

IPC Market Research

IPC Market Research

New Equipment | Education/Training

The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex

Association Connecting Electronics Industries (IPC)

Microvia Laser Drilling Services

Microvia Laser Drilling Services

New Equipment | Other

MLT provides microvia laser drilling services for both rigid and flexible circuit board manufacturers.  MLT is a leader in HDI drilling and design consulting to minimize drilling costs.  All IPC high density microvia types are supported in most any s

Micron Laser Technology

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

New Equipment | Prototyping

Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture

Heros Electronics (Shenzhen) Co., Ltd.

High-density multilayer PCBs for Wireless LAN Card

High-density multilayer PCBs for Wireless LAN Card

New Equipment |  

Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold

Ludee Circuits

High-density multilayer PCBs for Wireless LAN Card

High-density multilayer PCBs for Wireless LAN Card

New Equipment |  

Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold

Ludee Circuits

PCB Laser Services

PCB Laser Services

New Equipment | Depaneling

MLT provides rigid and flexible circuit laser services including laser routing (excising), cavity skiving, coverlay/coverfilm routing, microvia drilling, ZIF Contours, Kapton window skives, depaneling, and marking. With 20 years experience, MLT has

Micron Laser Technology

Qualitek Electronics (M) Sdn Bhd

New Equipment |  

Double-Sided & Multi-Layer PCB Material: - FR-4 / Hi-Temp FR-4 / FR-5 / G10 / BT / Polyimide - Very Thin PCB: 0.004" 2L ~ 0.030" 8L - Thick Copper: 1/4 oz. ~ 11 oz. Process: - PTH - Blind/Buried/Segmented Via - Sequential Lamination - MicroVia Capa

Qualitek Electronics (M) Sdn Bhd

10 layers HDI PCB prototype blind and buried holes board(2+6+2)huanyupcb.com

10 layers HDI PCB prototype blind and buried holes board(2+6+2)huanyupcb.com

New Equipment | Prototyping

Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com.  HDI (High Density Intrerconnection) is defined as substrate or board with the Microvia of aperture below 6mil, hole pad below 0.25mm, connect pad density above 130 points / square inch

PCB Manufacturer HuanYu Technologies Co., Ltd.

8 layers 1-stage HDI board huanyupcb.com

8 layers 1-stage HDI board huanyupcb.com

New Equipment | Prototyping

Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com.  HDI (High Density Intrerconnection) is defined as substrate or board with the Microvia of aperture below 6mil, hole pad below 0.25mm, connect pad density above 130 points / square inch

PCB Manufacturer HuanYu Technologies Co., Ltd.

PE-100 Plasma Etch Benchtop Plasma System

PE-100 Plasma Etch Benchtop Plasma System

New Equipment | Prototyping

Compact Plasma Etcher The PE-100 is a complete system with vacuum pump designed to be reliable yet inexpensive enough to allow startup companies, medical labs and R&D facilities the opportunity to experience Plasma Etch technology. The all aluminum

Plasma Etch, Inc.

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microvias searches for Companies, Equipment, Machines, Suppliers & Information

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