Industry Directory: microvias test (4)

Lloyd Doyle

Industry Directory |

Lloyd Doyle designs, manufactures and markets sophisticated automatic optical test (AOT) systems used in the bare board sector of the printed circuit board manufacturing industry.

Technology Seminars, Inc.

Industry Directory | Consultant / Service Provider

Serving the Educational Needs of Modern Technologies

New SMT Equipment: microvias test (4)

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

New Equipment | Prototyping

Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture

Heros Electronics (Shenzhen) Co., Ltd.

CA Design Printed Circuit Board Service Bureau

CA Design Printed Circuit Board Service Bureau

New Equipment |  

Printed Circuit Board Design Service Bureau for high quality, low cost source for Printed Circuit Design, Training, Fabrication, and Project Management. While every job is unique, CA Design employs a battle-proven process for ensuring that your desi

CA Design

Electronics Forum: microvias test (8)

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us


Electronics Forum | Mon Jan 17 19:29:54 EST 2000 | Michael Allen

I'm searching for technical papers on the topic of via-in-pad (through-vias, not micro-vias) -- hopefully with reliability test results. There's been zero response to this question in the past, but I thought I'd ask again. References would be great

Industry News: microvias test (46)

Deep Micro-vias Available on Large-format PCBs

Industry News | 2003-02-25 08:18:29.0

Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.


IPC’s Annual High Reliability Forum Adds Microvia Summit to Conference Lineup Event to discuss solutions to microvia challenges and reliability concerns for Class 3 electronics

Industry News | 2019-03-25 19:02:23.0

IPC’s High Reliability Forum and Microvia Summit, a three-day technical conference to be held in Hanover, Md., May 14-16, will focus on electronics for mil-aero, automotive, and long-life applications.

Association Connecting Electronics Industries (IPC)

Technical Library: microvias test (8)

Reliability of Stacked Microvia

Technical Library | 2015-05-14 15:45:45.0

The Printed Circuit Board industry has seen a steady reduction in pitch from 1.0mm to 0.4mm; a segment of the industry is even using or considering a 0.25mm pitch. This has increased the use of stacked microvias in these designs. The process of stacking microvias has been practiced for several years in handheld devices; however, the devices generally do not operate in harsh conditions. Type 1 and Type 2 microvias have been tested over the years and have been found to be very reliable. We do not have enough test data for 3 and 4 stack microvias when placed on and off buried via. The main objective of this study was to understand the reliability of 3 and 4 stack microvias placed on and off a buried via.

Firan Technology Group

Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias

Technical Library | 2016-11-30 15:53:15.0

The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.


Training Courses: microvias test (1)

IPC-A-600 Acceptability of Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)

The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.

PIEK International Education Centre

Events Calendar: microvias test (1)

Qualification and Reliability of Microvias

Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,

Qualification and Reliability of Microvias

CALCE Center for Advanced Life Cycle Engineering

Career Center - Resumes: microvias test (1)

PCB Layout Designer

Career Center | Coimbatore, Tennessee India | 2017-06-05 07:55:08.0


Express Newsletter: microvias test (818)

SMTnet Express - July 14, 2022

SMTnet Express, July 14, 2022, Subscribers: 25,319, Companies: 11,585, Users: 27,344 █  Electronics Manufacturing Technical Articles Reliability Testing For Microvias In Printed Wire Boards Traditional single level microvia structures

SMTnet Express - May 14, 2015

SMTnet Express, May 14, 2015, Subscribers: 22,738, Members: Companies: 14,345 , Users: 38,183 Reliability of Stacked Microvia Hardeep Heer, Ryan Wong; Firan Technology Group The Printed Circuit Board industry has seen a steady reduction in pitch

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