Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative / Training Provider
Global OEM manufacturer of selective wave soldering machines. With a world-wide install base in over 65 countries, we are a global leader in the selective soldering space. Highly customized solutions available in all industries.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Electronics Forum | Fri May 27 07:14:21 EDT 2011 | janz
Hello, I am looking for companies which supply AOI for 3D - MID substrates. (MID- moulded interconnect devices). Regards Janz
Electronics Forum | Fri Oct 20 10:15:13 EDT 2006 | wrongway
mid chip solder balls we had that trouble for awhile we went from a 8 mil thick stencil to 6 mil stencil and did some home plate style of cut outs in the stencil for the 1206 caps and resistors it seemed to fix our mid chip solder balls
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Used SMT Equipment | Assembly Accessories
E BY DEK DEK’s experienced printing specialists have developed an innovative platform for E by DEK with high-quality components, sophisticated construction, and modular design that guarantees a stable and reliable printing process even for the latest
Used SMT Equipment | General Purpose Equipment
Very nice Tyco Press For Sale Tyco Model: AEP-12T Year 2007 Windows XP 12 Tons Board Capacity: 36 x 48" PC controlled servo electric press for fine control of speed, force and height up to 12 tons [107 kN] of pressing capacity Monitors inse
Industry News | 2016-02-27 22:11:00.0
GPD Global has advanced its auger pump technology with the introduction of the newly developed Precision Auger Pump. This pump was designed to offer a wide range of functionality in your process development by being compatible with a wide range of auger/cartridge assemblies.
Industry News | 2012-01-17 15:18:10.0
GPD Global will be exhibiting in Booth #4321 at the upcoming MD&M West Conference and Expo, scheduled to take place February 14-16, 2012 at the Anaheim Convention Center in Anaheim, CA.
Parts & Supplies | Pick and Place/Feeders
JUKI 2050 Y shaft motor small belt If the small belt on the JUKI 2050 2060 X-axis Y-axis motor pulley be damaged,which only need replace the small belt,don't need to replace the entire pulley assembly, saving costs. JUKI2050/60 belt series 4000086
Parts & Supplies | SMT Equipment
KV1-M9119-00X DAMPER 2, W 4 KV1-M9121-00X STAY, MID SENSOR 1 KV1-M9122-00X COVER, MID SENSOR 1 KV1-M9123-00X GUIDE 1, END 4 KV1-M9124-00X GUID
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Oaks, Pennsylvania USA
Mid-Atlantic Design-2-Part Show
Career Center | Bedford, Texas USA | Sales/Marketing
Sell SMT/PCBA capital equipment in S.NJ, MD, PA, and DC area. Candidate will be calling on any potential account and focusing on two major established accounts there. Candidate should have a recent and significant succesful track record in selling
Career Center | Atlanta, Georgia USA | Engineering
Our client is an electronics manufacturing firm. They have a need for a quality assurance engineer now! Location is mid-South.
Career Center | Duluth, Georgia USA | Management,Sales/Marketing
Over 20 years of experience selling high tech capital equipment for manufacturing. ��Accomplished in territory management, regional sales management, and key account management ��Proficient at managing several projects, coordinating engineering deve
Career Center | Johns Creek, Georgia USA | Management,Sales/Marketing
As an awarding winning Regional Sales Manager, I have specialized in securing and growing key accounts in the electronics and materials manufacturing industries. I have been described as a go-getter, energetic, analytical hands-on sales person. In c
SMTnet Express, December 7, 2016, Subscribers: 27,507, Companies: 15,035, Users: 41,441 Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling Katherine Wilkerson, Ian J. Wilding, Michael Carter, Daniel Buckland
Heller Industries Inc. | https://hellerindustries.com/parts/586935/
586935 - Mid Shaft Assy Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/j6602026a-flat-belt-mid-147273?page=50&category=1182
SAMSUNG FLAT BELT (MID) J6602026A | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products Others SMT parts FLAT BELT (MID
