Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
New Equipment | Board Handling - Storage
Solder paste printing range (1) SMT technology of resistance, capacitance, inductance, diode, triode and other chip components production and processing: 01005, 0201, 04020603, 0805, 1206 and other specifications and sizes; (2) , IC: support SOP, T
New Equipment | Assembly Services
Product features: The servo system is convenient and accurate for positioning. The Japanese THK guide rail and Taiwan STK variable frequency motor are used to drive the scraper base to ensure the printing accuracy. The printing scraper can be rota
Electronics Forum | Thu Jun 06 15:55:28 EDT 2002 | arzu
I agree with the others and experienced the problem myself this week. Solderballs at the side of the chips. I looked at the board and found that the chip is pressing the paste away too much. This in combination with our quite big pads(and stencilaper
Electronics Forum | Tue Jun 04 17:21:22 EDT 2002 | jasonfang
I found solderballs are around chip components (on one side of middle area), I checked gerber data, solder paste of aperture on the stencil for these chip components have 5% reduction to solder land on PCB, shape of solder land are square, not home p
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100xg placement machine parameters High-speed, high-precision, multi-functional modular placement machine 0.18 seconds/CHIP ultra-high-speed placement (best conditions) 16200CPH (grains/hour) In the IPC9850 state, the patch speed is as high
Used SMT Equipment | Pick and Place/Feeders
BRAND : JUKI / MODEL : KE- 2020M DESCRIPTION :- Used SMT Equipment Juki KE-2020M Pick and Place Machine Chip Shooter Machine Soldering Machine SMT Chip Mounter SPECIFICATION :- Pick and place system (5) Heads / Feeder float detection (2) Trolleys
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Parts & Supplies | Component Packaging
SAMSUNG FN-14 J7055336A SAMSUNG FN-08 J7055335A SAMSUNG FN-05 J7055334A SAMSUNG AIR TUBE (POLYURETHANE) TU0604B J6713030A SAMSUNG AIR TUBE UB1065B J6713013A SAMSUNG AIR TUBE (POLYURETHANE) TU0805B J6713027A SAMSUNG BALL SPLINE UNIT Z-AXIS J6611
Parts & Supplies | Pick and Place/Feeders
J31521026A SP1 STEP MOTOR DRIVER 4AXIS MD2B-SD15-4X Other Samsung parts: SAMSUNG FN-14 J7055336A SAMSUNG FN-08 J7055335A SAMSUNG FN-05 J7055334A SAMSUNG AIR TUBE (POLYURETHANE) TU0604B J6713030A SAMSUNG AIR TUBE UB1065B J6713013A SAMSUNG AIR
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)
Yamaha S10 SMD Placement 3D Hybrid Modular SMT Mounter ❙ Features of Yamaha SMD Placement ETA Providing new compact economy flexible modular Yamaha SMD placement, Yamaha SMT mounter for laptop production line. We provide overseas services, te
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Career Center | Duluth, Georgia USA | Management,Sales/Marketing
Over 20 years of experience selling high tech capital equipment for manufacturing. ��Accomplished in territory management, regional sales management, and key account management ��Proficient at managing several projects, coordinating engineering deve
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMTnet Express, December 7, 2016, Subscribers: 27,507, Companies: 15,035, Users: 41,441 Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling Katherine Wilkerson, Ian J. Wilding, Michael Carter, Daniel Buckland
SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad
Heller Industries Inc. | https://hellerindustries.com/parts/586935/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
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