New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
New Equipment | Solder Materials
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a
Electronics Forum | Fri Oct 20 10:15:13 EDT 2006 | wrongway
mid chip solder balls we had that trouble for awhile we went from a 8 mil thick stencil to 6 mil stencil and did some home plate style of cut outs in the stencil for the 1206 caps and resistors it seemed to fix our mid chip solder balls
Electronics Forum | Tue Jul 15 15:46:05 EDT 2008 | slthomas
Can you describe your solder balls...mid-chip solder balls, "splatter" around pads, etc.?
Industry News | 2012-06-25 12:49:28.0
Nihon Superior, will introduce a new product, SN100C P810 D4 low-voiding lead-free solder paste, at the upcoming IPCA International Expo, scheduled to take place July 25-27, 2012 at the KTPO Trade Centre in Bangalore, India.
Industry News | 2009-11-11 12:21:33.0
OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd. announces that it has been awarded a 2009 Global Technology Award in the category of Soldering Materials for its SN100C P600 D4 Solder Paste. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
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SMTnet Express, December 7, 2016, Subscribers: 27,507, Companies: 15,035, Users: 41,441 Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling Katherine Wilkerson, Ian J. Wilding, Michael Carter, Daniel Buckland
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/software?con=t&page=10
) Nordson ASYMTEK Infinit-Manual-Short-GSM-28V24R14-Eng Nordson ASYMTEK Precise, high-throughput underfill dispense in chip-on-wafer packaging Nordson ASYMTEK H. Liang
