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Electronics Forum | Mon Dec 03 20:12:41 EST 2001 | Kelvin Kok
Hi Peterson, We are in the business of manufacturing wave, SMT pallets and all kinds of toolings. With our 11 years expertise, we definitely able to meet your requirements with quality products. With our location in Silicon valley and supporting ma
Industry News | 2012-08-29 11:04:22.0
Europlacer recently added a new member to its customer support team – Senior Field Service Engineer Viet Nguyen.
Industry News | 2016-05-24 18:17:42.0
ZESTRON is pleased to announce that it will cohost free workshops in California this June with Aqueous Technologies, Para Tech, Mirtec, KIC, Henkel, SpecCoat, and Indium. This free collaborative one day workshop will be held in Carlsbad on June 7th and Milpitas on June 9th.
Technical Library | 2019-01-23 21:33:32.0
Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process, reducing the Cost of Repair as the AOI systems identify the specific components that are failing removing the need for any additional test troubleshooting1-3. Because of this, more Electronic Contract Manufacturing Services (EMS) companies are implementing AOI into their SMT lines to minimize repair costs and maintain good process and product quality, especially for new component types. This project focuses on the testing of component package 03015 which is challenging for AOI.
Technical Library | 2015-07-14 13:19:10.0
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.
Career Center | Forney, Texas USA | Engineering,Management,Production
A hands-on, highly talented and accomplished manager with extensive skills and expertise in scheduling, engineering and management within a manufacturing environment. Seeking a position as manager with a company that allows for career advancement thr
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Watchfire Signs Danville, IL WinTronics, Inc. Sharon, PA Zentech Manufacturing, Inc. Baltimore, MD Zollner Electronics Inc. Milpitas, CA ZTE Corporation Shenzhen, , China Upcoming Events February 28 2020 SMTA Chapter Officer's