Industry Directory: mismatch (2)



Industry Directory | Laminates

Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology

G2 Technology

G2 Technology

Industry Directory | Service Provider

G2 provides a complete, integrated, cloud-based solution that increases manufacturers' visibility, control and recovery of revenue.

New SMT Equipment: mismatch (34)



New Equipment |  

STABLCOR� is a Thermally Managed PCB / Substrate material technology with many benefits: High Thermal Conductivity with a product family that ranges from 100 W/m K up to 1000 W/m K Can more closely match the CTE mismatch that is common today bet


Agilent 86105A-202 20GHz Electrical/20GHz Optical Plug-In Module

Agilent 86105A-202 20GHz Electrical/20GHz Optical Plug-In Module

New Equipment | Test Equipment

Agilent 86105A-202 20GHz Electrical/20GHz Optical Plug-In Module The Agilent 86105A incorporates two measurement channels -- one optical, the second electrical. Each channel has two selectable bandwidth settings. In the lower bandwidth mode of 12

Recon Test Equipment Inc.

Electronics Forum: mismatch (118)

CTE mismatch

Electronics Forum | Thu Sep 14 14:37:45 EDT 2000 | Serrena Carter

Does anyone know where I can find good rule of thumb information on soldering/brazing. I am most interested learning the maximum recommended CTE mismatch between two different materials that thermally cycle between 25-100C.

TCE mismatch

Electronics Forum | Wed Feb 07 18:40:39 EST 2007 | bill

What is an acceptable mismatch for smt components and pcb. We are having cracked solder joints from fatigue after repeated thermal cycling 25 deg. c to 125 deg.c.

Used SMT Equipment: mismatch (17)

Agilent E5061B

Agilent E5061B

Used SMT Equipment | In-Circuit Testers

Description The E5061B-010 time domain/fault location analysis option allows you to locate the discontinuities and mismatches of devices such as cables. By employing the gating function in the time domain and transforming the data back to the freque

Shenzhen jiahuijie technology Co,;Ltd

Agilent E4412A

Agilent E4412A

Used SMT Equipment | In-Circuit Testers

Agilent E4412A The Agilent E4412A diode power sensor, with wide dynamic range, is designed for use with the EPM and EPM-P series power meters for power measurements on CW signals from 10 MHz to 18 GHz. The E4412A power sensor provides extremely l

Test Equipment Connection

Industry News: mismatch (20)

SMTA Capital Chapter Tutorial – Supporting High Reliability at the OEM: A PCB Perspective

Industry News | 2019-04-30 17:39:40.0

The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.

Surface Mount Technology Association (SMTA)

Indium Corporation Expert to Present at IMAPS Autumn Conference in Munich

Industry News | 2018-10-15 18:42:06.0

Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany. At the conference, Karch will deliver his presentation entitled New Solder Alloy with Extended Temperature Range for High-Reliability Applications. He will review test results that demonstrate how a new alloy excels in harsh environments, including wide temperature range and high CTE mismatch. Karch will also share data from existing application qualifications.

Indium Corporation

Technical Library: mismatch (97)

Dam and Fill Encapsulation for Microelectronic Packages

Technical Library | 1999-08-27 09:29:49.0

Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...


Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.


Videos: mismatch (2)

Thermal Profiling: How to Inspect your Reflow Process

Thermal Profiling: How to Inspect your Reflow Process


There is SPI for Screen Printing. AOI for Pick and Place. Now there is RPI (Reflow Process Inspection) for the Reflow Oven. KIC's RPI provides production reports such as yield analysis, DPMO, Pareto Charts, Cpk and much much more. When RPI is use

KIC Thermal



Many Cusromers inquiry Headpcb's capabilty of counter sink board, and they are easy to mismatch counter sink with counterbore. In fact, there have big difference between counter sink and counterbore, today Headpcb's senior RD engine


Express Newsletter: mismatch (11)

Partner Websites: mismatch (87)

How to quickly solve the signal integrity problem of high speed systems


. The higher the signal frequency, the greater the attenuation, which can cause power level mismatch in the specified data stream, which in turn causes ISI to occur in the signal

Video: BGA Processing for Reliability


. Methods of adjusting the manufacturing process to compensate for an alloy mismatch are presented. Also presented are methods to ensure a matching of alloys by modifications to the raw materials

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SMT feeders

PCB Assembly Supplies - ONLINE STORE
RETROFIT for More Effective Dispensing

Easily dispense fine pitch components with ±25µm positioning accuracy.
ACI Technologies, Inc - One Day Training