PC boards and kits for machine set-up and calibration, hand solder training, rework, practice, testing and more along with a drawing of each PCB. Practical has a PCB board or kit to meet your requirements. BGA Fine Pitch, Global Daisy-Chain or Vari
Electronics Forum | Fri Jan 27 15:12:48 EST 2006 | GS
From technical point of view: it should not be a problem to mix Pb with Pb Free components soldered with a LF solder process. You have to take care about the max temperature allowed on your Pb components and make sure they can withstand the higher
Electronics Forum | Fri Jan 27 10:58:11 EST 2006 | mafc65
We are running our prduction (TV's)with Lead Free Solder, since 1 year ago, but we still have a lot of Electrolityc Capacitor (Thruhole and SMT)in stock that are for PB Solder. We have to use them before February-06. Do anybody know if there is a pro
Industry News | 2010-01-22 21:46:55.0
Minneapolis, MN - The SMTA is pleased to announce several new online presentations coming up in February. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.
Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
Technical Library | 2022-10-31 17:30:40.0
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb-free
SMTnet Express, January 8, 2015, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies Richard
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/certifications-and-standards
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GPD Global | https://www.gpd-global.com/co_website/pdf/dispense/Dispensing-Systems-and-Pumps-Overview.pdf
. With an available 3 zones of heat for inline systems as well as fluid heating, your process will be completely under control. For batch applications, the work table is heated and can be customized for your product
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