1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Electronics Forum | Thu May 20 02:46:01 EDT 2004 | Jo
�Now I can use Idle gas mode but I want to set N2 Idle Time because it will work when the furnace empty instantly So, the question is How could I set N2 idle timer and pressure regulator ,
Electronics Forum | Wed Oct 29 10:36:33 EDT 2014 | blainemoran
Looking for a maintenance mode on the NPM-W where I can isolate and fire different components. For example if I suspected a bad motor is there a way to just attempt to fire that. Any advise?
Used SMT Equipment | Pick and Place/Feeders
Software: 2.9.x T3 Linear Table Electrical Two-Pole Test Electrical Transistor Test Optical Centering Conveyor Shared Databases Hydra Z High Speed Hydra High Speed Autoteach Linescan for Z Line Mode Fast Place Sequence
Used SMT Equipment | Pick and Place/Feeders
Software: 2.9.x T3 Linear Table Electrical Two-Pole Test Electrical Transistor Test Optical Centering Conveyor Shared Databases Hydra Z High Speed Autoteach Linescan for Z Line Mode Fast Place Sequence
Industry News | 2017-11-07 23:20:25.0
GPD Global offers a cost-effective, automated Conformal Coating System (SimpleCoat) with excellent repeatability for just under $40,000!!!
Industry News | 2016-07-16 13:32:29.0
Advanced dispense technology is available for integration into your dispensing system. Continuously Volumetric, drip-and-drool free dispense technology can now be retrofitted into your dispense robot. GPD Global's Volumetric PCD pumps ensure the success of applications like underfill, LED encapsulation, solder mask, silicones, conductive ink, conformal coatings, and more. Improve your throughput and yields by retrofitting a Volumetric PCD Pump into your dispense system to simplify the dispense process.
Parts & Supplies | Semiconductor & Solar
JUKI JX-100LED SMT machine parameters High speed SMT machine JX-100LED Size of substrate Min. 50*50 ~ Max. 800*360mm The substrate positioning mode only corresponds to the contour reference mode Component height 12.0mm Component size 0201 (metr
Parts & Supplies | Pick and Place/Feeders
yamaha nozzle for for all mode machine YG200 KV8-M71N1-A0 YG200 71F ASSY NOZZLE (201F) KV8-M71N2-A0 YG200 72F ASSY NOZZLE (202F) KV8-M71N9-A0 YG200 79F ASSY NOZZLE (209F) KV8-M71N3-A0 YG200 73F ASSY NOZZLE (203F) KV 8-M87XD-A0 YG200 73F-D ASS
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
http://www.gpd-global.com Conformal coating (SimpleCoat) demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system. The Spray Valve sprays HumiSeal 1B31 from a height of approximately 20 mm above the board. The Volumetr
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Thu Aug 20 00:00:00 EDT 2020 - Thu Aug 20 00:00:00 EDT 2020 | ,
Avoiding the Most Common PCB Failure Modes
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Career Center | Delavan, Wisconsin USA | Production
*Set up printers, placement machines and reflow ovens for production. *Adjust machine parameters and CAM programs *Optimize part placement and feeder applications through CAM programs *Manipulate SPC data for solder paste height measrurements and int
Career Center | Clarksburg, Maryland USA | Engineering,Production,Technical Support
SMT SOLDER SPECIALISTSMultiple openings available at Thales Communications, Inc., in Clarksburg, MD. Responsibilities: Candidate must be able to consistently work under a scope for 8 hours per day. Additionally, this position requires that you work w
Career Center | Alleppey, Kerala India | Engineering,Production,Quality Control
Good knowledge about the operations of various PCB surface mounting machines Good communication skills
Career Center | , | 2014-01-31 02:17:45.0
Good knowledge about the operations of various PCB surface mounting machines Good communication skills
SMTnet Express, December 11, 2014, Subscribers: 23,586, Members: Companies: 14,135 , Users: 37,386 Failure Modes in Wire bonded and Flip Chip Packages Hikmat Chammas - Peregrine Semiconductor The growth of portable and wireless products is driving
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_batch-mode-in-altium_topic2224.xml
PCB Libraries Forum : Batch mode in Altium PCB Libraries Forum : Batch mode in Altium This is an XML content feed of; PCB Libraries Forum : Altium
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Autonomous driving—a future mode of mobility DE Deutsch English Discover productronica Trade fair topics PCB & EMS SMT Cables, Coils
