Technical Library: model (Page 1 of 33)

Conformal Coating Process Characterization Considerations

Technical Library | 2013-09-25 20:57:24.0

Conformal coating is an enabling process that allows for the ruggedizing of electronic devices and modules. As the process increases the durability of electronics that are subjected to various end-use environmental conditions, it adds value to the product. While it does add value, consumers and manufacturers expect the electronics to work when subjected to dirt, humidity, moisture, corrosive materials, and various other contaminants. This expectation results in a drive to minimize the cost of the process. The lowest cost of ownership for a conformal coating process occurs by utilizing automated selective conformal coating equipment.


Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution

Technical Library | 2009-07-01 09:24:25.0

During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.

ZESTRON Americas

Back to Basics – Why Clean?

Technical Library | 2011-06-28 16:10:29.0

ZESTRON America’s spring edition of ZESTRON News goes back to basics providing the latest information on the topics of cleaning in the electronics manufacturing industry.

ZESTRON Americas

Conductive Adhesive Dispensing, Process Considerations

Technical Library | 1999-08-27 09:24:56.0

Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.


Soldering Faster At Lower Temperatures: A Performance Comparison

Technical Library | 1999-05-09 13:14:02.0

Studies and tests of comparative soldering iron thermal performance at low temperatures - Metcal direct power soldering technology compared to conventional stored energy soldering irons from leading manufacturers.


Virtual Manufacturing

Technical Library | 2019-09-16 09:41:02.0

“What is Virtual Manufacturing?” The simplest answer is a manufacturing simulation using a computer. The more complete answer is that virtual manufacturing is the process of designing a model of a real system and conducting experiments with this model for the purpose of understanding the behavior of the system. In today’s complex manufacturing environment, processes must be completely understood before implementation in order to “get it right the first time.” To achieve this goal, the use of a virtual environment is essential for simulating individual manufacturing processes and the total manufacturing system. By driving compatibility between the product design and the assembly plant process, these virtual tools enable the early optimization of cost, quality, and time to help achieve integrated products, process and resource design, and affordability.

ACI Technologies, Inc.

Mechanical Drop Shock Testing

Technical Library | 2020-02-03 17:37:36.0

Accurate impact testing is a key component to establishing that a product is not only reliable, but durable in an end-use environment. ACI Technologies tested a high-g circuit board to demonstrate component durability and ruggedization for guided munitions. The Lansmont Model 23 Shock Test System customized with a Dual Mass Shock Amplifier was used for this testing (Figure 1).

ACI Technologies, Inc.

Computer Aided Design, Manufacturing, and Engineering

Technical Library | 2019-07-01 10:44:11.0

In the electronics industry of today, companies emphasize better quality, lower cost, and shorter lead time on their products in order to keep up with their competitors. ACI Technologies (ACI) has been utilizing Computer Aided Design (CAD), Computer Aided Manufacturing(CAM), and Computer Aided Engineering (CAE) in its development of advanced electronics systems. CAD utilizes computer systems to assist in the creation, modification, analysis, and optimization of a design [1].

ACI Technologies, Inc.

Design of Experimentation for Affordability

Technical Library | 2019-07-11 11:07:08.0

Affordability is not exactly the primary word which comes to mind when discussing the use of design of experiments (DOE) principles, but is generally accepted as a necessary part of the engineering activities required in the development of a product or process. However, a number of studies have indicated that the cost savings derived from a well deliberated experimental design can be substantial in the initial stages where the conditions or parameters of a process are determined. Some studies have shown a greater than 50% cost savings compared to the more conventional means of trial and error approaches to process development. At ACI Technologies (ACI), we have found the use of DOE techniques fundamental in eliminating extraneous costs otherwise spent on unnecessary testing.

ACI Technologies, Inc.

Thermal Interface Materials Testing

Technical Library | 2019-05-30 11:04:03.0

There exists a need to efficiently remove heat from power electronics within power systems to enhance performance. Thermal management is a critical function to that operation. Reducing the junction temperature of semiconductor power electronic devices enables them to operate at higher currents. Lowering operating temperatures reduces the thermal stress on electronic devices, which improves efficiency and reduces failures. To improve the heat removal process, the current heat transfer design of a power system has been analyzed and a variety of thermal interface materials (TIMs) and cold plate technologies have been evaluated. This paper will review some of these results.

ACI Technologies, Inc.

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