Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields SMT/PCBA Semiconductor L
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields SMT/PCBA Semiconductor Lith
Industry News | 2019-09-03 22:19:17.0
The biggest Asian Electronics Events "Nepcon Asia 2019" was closed last Friday, thank you all the professionals to visit our Unicomp booth to deeply discuss the new features of X-ray technologies for BGA soldering inspection as well as SMD Chip counting application.
Industry News | 2020-10-24 02:04:11.0
On November 3rd to 5th, 2020,Unicomp Technology will bring the latest technology and products to the ELECTRONIC SOUTH CHINA 2020,Welcome to visit the Unicomp Technology booth at 9D30,Hall 9. Shenzhen International Convention and Exhibition Center!
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