Industry News: moisture and insulation and resistance (Page 1 of 5)

Session 2 Agenda for the High-Reliability Cleaning and Coating Conference

Industry News | 2012-10-18 19:02:31.0

IPC and SMTA jointly announce the agenda for Session 2 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel

Association Connecting Electronics Industries (IPC)

Practical Support on Cleaning and Contamination Monitoring Processes Printed Board Assembly Cleaning and Contamination Testing Center to Debut at IPC APEX EXPO 2013

Industry News | 2012-12-03 19:52:39.0

Printed Board Assembly Cleaning and Contamination Testing Center marks its debut at IPC APEX EXPO®, February 19–21, 2013, at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

Unlock the Future of Electronics Manufacturing: Gen3 and Zestron Workshop

Industry News | 2023-08-21 12:19:15.0

Gen3, a global leader in SIR (Surface Insulation Resistance), CAF (Conductive Anodic Filament), solderability, ionic contamination, and process optimization equipment, along with Zestron, renowned experts in cleaning and reliability solutions, are thrilled to announce an enlightening workshop focused on Electronics Manufacturing Processes: Where Quality Assurance Meets Surface Reliability. This informative seminar is scheduled to take place on Wednesday, September 6, 2023, at the Manufacturing Technology Centre in Ansty Park, Coventry.

Gen3 Systems

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2016-09-08 13:30:10.0

Engineered Material Systems is pleased to introduce the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2017-10-22 17:38:10.0

Engineered Material Systems is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

CableEye® Training and Verification Adapter Board, CB-T1

Industry News | 2015-08-05 14:49:25.0

CAMI Research announces a new, dual-purpose connector board for training new users on its CableEye cable and harness testing systems, and for performing tester system verification.

CAMI Research Inc.

When You Should Use an Absolute Encoder - Pros and Cons of Different Absolute Encoders

Industry News | 2021-12-28 20:23:06.0

As is known to us, rotary encoders consist of incremental encoders and absolute encoders. And absolute encoders are much more expensive than incremental encoders. In fact, both two types of encoders are used for position measurement. So what's the point of using an absolute encoder? For distance measurement applications, both incremental and absolute encoders can be chosen - from a technical point of view. The advantages of absolute encoders are reflected in accuracy and performance, while incremental encoders seem more economical and practical.

OKmarts Industrial Parts Mall

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Join Bob Willis at the Cleaning and Contamination Centre

Industry News | 2012-11-22 03:27:45.0

The clinic is organized by IPC and National Physical Laboratory

ASKbobwillis.com

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

Industry News | 2017-08-10 17:50:15.0

Engineered Material Systems is pleased to introduce the DF-3590 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

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