Industry Directory | Manufacturer's Representative
World’s Largest Manufacturer of static shielding bags, moisture barrier bags, wrist straps and heel grounders. Our catalog features dry packaging, shielding bags, desiccant, vacuum sealers, humidity indicator cards, wrist straps, table and floor mats, heel grounders, meters, informational bulletins, and more. See our web site at www.scc-inc.com
Industry Directory | Manufacturer's Representative
World’s Largest Manufacturer of static shielding bags, moisture barrier bags, wrist straps and heel grounders. Our catalog features dry packaging, shielding bags, desiccant, vacuum sealers, humidity indicator cards, wrist straps, table and floor mats, heel grounders, meters, informational bulletins, and more. See our web site at www.scc-inc.com
Humitector™ Type 2 Humidity Indicator Card, used together with a Desi Pak® desiccant, can help provide a complete history of a dry pack environment for moisture sensitive surface mount devices (SMD's) (MSD - moisture sensitive
Provides moisture barrier and ESD protection in "dry-packaging" of static and moisture sensitive components, PCB's and disk drive assemblies.
Electronics Forum | Fri Jul 09 11:25:42 EDT 2021 | dontfeedphils
> ...but the part has too much moisture. How do you know?
Electronics Forum | Wed Mar 23 10:16:47 EDT 2011 | blnorman
If these are moisture sensitive they are required to be shipped in a moisture barrier bag and labeled as moisture sensitive. Depending on which moisture sensitivity level (MSL) the components have, floor life can range from unlimited to a mandatory
Industry News | 2019-10-22 12:34:34.0
Humitector™ Type 2 delivers advanced sustainable attributes including halogen-free*, cobalt dichloride-free, and reduced cobalt dibromide content The use of Type 2 Humidity Indicator Cards with a non-reversible 60% RH spot indicator is preferred by IPC/JEDEC standard J-STD-033D.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Technical Library | 2021-11-26 14:34:07.0
The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long#2;standing practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available
Technical Library | 2022-10-11 17:27:08.0
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature, high alloy surface tension, miniaturization, air soldering due to low cost consideration, and environmental concern. Accordingly, the flux features desired included high thermal stability, high resistance against burn-off, high oxidation resistance, high oxygen barrier capability, low surface tension, high fluxing capacity, slow wetting, low moisture pickup, high hot viscosity, and halogen-free. For each of the features listed above, corresponding desired chemical structures can be deduced, and the impact of those structures on flux residue cleanability can be speculated. Overall, lead-free flux technology results in a greater difficulty in cleaning. Cleaner with a better matching solvency for the residue as well as a higher cleaning temperature or agitation are needed. Alkaline and polar cleaner are often needed to deal with the larger quantity of fluxing products. Reactive cleaner is also desired to address the side reaction products such as crosslinked residue.
Humitector™ Type 2 Humidity Indicator Card, used together with a Desi Pak® desiccant, can help provide a complete history of a dry pack environment for moisture sensitive surface mount devices (SMD's) (MSD - moisture sensitive
A Sustainable Alternative - Humitector™ Type 2 cards are halogen-free and cobalt dichloride free. For more information on Type 2 Humidity Indicators, visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-
ASCEN Technology | https://www.ascen.ltd/Blog/machine/Conformal_coating_machine/997.html
static.It can be full panel coating or selective coating.This PCB coating equipment eliminates the microscopic bubbles,common in other sealant applications,and provides a superior moisture barrier
ORION Industries | http://orionindustries.com/pdfs/frfilm.pdf
– Thermal Index Electrical°C – 125 125 120 UL PERFORMANCE LEVEL CATEGORIES Moisture Absorption (%) 0.40 0.40 0.40 0.40 Shrinkage (%) <1.0@150°C <1.0@150°C <1.0@150°C – LEXAN®, VALOX® and ULTEM® films from GE Structured Products provide cost-effective solutions in applications ranging from simple, flat barrier insulation to highly complex, three- dimensional EMI/RFI shielding
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