Industry Directory | Consultant / Service Provider / Manufacturer
Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.
Industry Directory | Manufacturer
Embedded Computing & Packaging for Integrated Systems. Industry Standards
New Equipment | Assembly Services
Printed Circuit Board Assemblies Valuetronics has experience in many methods of printed circuit board assembly from through hole and mixed technology to customized fine pitched surface mount technologies. Our process capabilities include: 01005
Do you have a unique component that isn’t available in tape and reel? Tired of hand placing those components because you don’t have a compatible feeder? Can’t find JEDEC trays for your components and you need one yesterday? The answer to all of
Electronics Forum | Sun Dec 02 20:02:23 EST 2007 | chs
Hi, There are QFN 32,40,48 pins with middle pad. Body size are 7x7 and pitch 0.5mm. I means as compared to 2 sided package, QFN are easily damaged by external mechanical / thermal force. Phenomenon observed are mold cap open which further caused wire
Electronics Forum | Thu Jul 07 08:39:39 EDT 2011 | ianjames
How to compensate the back pressure effect that affect the wire of SMT molded package? The wire looks like snake and we call-it snake wire. It only happen near the stitch.
Used SMT Equipment | In-Circuit Testers
Motorola R2670B Digital Communications System Analyzer Expandable Platform for Digital, Trunked, and Secure Testing In addition to including all the capabilities found in the R2600, the R2670 FDMA digital Communications System Analyzer is a sp
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight MSO6104A Agilent MSO6104A Mixed Signal Oscilloscope: 1 GHz, 4 scope and 16 digital channels If you work with both analog and digital circuitry, Agilent Technologies 6000 Series oscilloscopes can help you easily see more signal
Industry News | 2003-05-08 07:22:00.0
Over 400 contract manufacturers present every aspect of outsource capability.
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
.jpg)
Parts & Supplies | SMT Equipment
00373666-01 NRS TP-Transceiver CONTROL UNIT 00373716-01 Adhesive Tape:Tesa Extra Power 48mm wide 00373778-01 Servicebox SIPLACE HF-Series. Provided free of charge with initial system installation. Indicated price valid for additional orders. 00373
Parts & Supplies | SMT Equipment
03054923-02 ASM Nozzle 2033 240 pcs 03059921-02 ASM Nozzle 2038 120 pcs 03037746-01 ASM Hood axis 5 pcs K3035K Fuji Grease (NSK GRS NS7 80g) 5 pcs 2MGTHA067900 Fuji Filter 500 pcs MX100562 (DEK 141146) Matrix/ASM AFB-LF grease THK 50 pcs 800280
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
00373666-01 NRS TP-Transceiver CONTROL UNIT 00373716-01 Adhesive Tape:Tesa Extra Power 48mm wide 00373778-01 Servicebox SIPLACE HF-Series. Provided free of charge with initial system installation. Indicated price valid for additional orders. 00373
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Sat Jun 15 00:00:00 EDT 2019 - Thu Jun 20 00:00:00 EDT 2019 | Raleigh, North Carolina USA
IPC SummerCom
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: Experience in solid Edge CAD/CAM 3D system software and electronic packaging, Prior experience designing packaging systems a plus. Duties/Functions: Responsibility for the design of mechanical systems for electronic packaging. W
Career Center | Costa Mesa, California USA | Engineering,Sales/Marketing,Technical Support
SALES- Growth opportunity to join a growing Manufacturers Rep firm. Looking for an aggressive sales professional to cover San Diego and the Mexican boarder areas of Tijuana, Tecate and Mexicali. Previous sales experience required selling to ele
Career Center | Bangalore, Karnataka India | Sales/Marketing
Dear Mam / Sir, Greetings, My 22 years of Sales & Business Development experience in “Capital Equipments” (Plastic processing m/c's, Turn-key packaging m/c’s, etc.) should be of interest to a fast growing company like yours. My experience in vario
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/underfill
. Offering non-contact jetting systems for underfill dispensing with precision fluid placement. What is Underfill? Underfill is an epoxy material that fills gaps between a chip and its carrier or a finished package and the PCB substrate
| https://pcbasupplies.com/wp-content/uploads/2023/06/hulk-containers.pdf
) Bin Dimensions Guide L (length) W (width) H (height) X (inside length) Organize and store your large and bulky items with these strong injection molded high impact polypropylene, stackable containers
