Electronics Forum | Sun Nov 24 22:09:13 EST 2019 | fadzril
Does anyone have experience of mounting MID ( molded interconnect device )? What items are required to be prepared? Can I use my current printer, mounter or reflow ovens?
Electronics Forum | Fri Sep 18 07:16:18 EDT 1998 | Wayne Bracy
Steve: You might want to contact Advanced Interconnects I know they manufacture standard BGA fixtures, but not sure about micro BGA. Advanced Interconnects, Inc. West Warwick, RI (401) 823-5200 (401) 823-8723 Fax Howard Gonzales You could also call T
Electronics Forum | Mon Aug 15 18:42:53 EDT 2011 | bandjwet
Does anyone have experience in doing dye and pry analysis on PoPs? A customer wants to know whether or not the board level or device-device interconnect is the suspect. What other technique can anyone recommend? BWET
Electronics Forum | Mon Dec 20 14:44:30 EST 2004 | JohnS
I had identical issue with CBGA's. I also found stress fractures at the sphere/substrate interconnect. The supplier had data to support their acceptability but we persisted and they reworked them,
Electronics Forum | Tue Dec 16 06:59:47 EST 2008 | janz
Hello, I am looking for technical papers (tips, tricks. machines, materials etc) for MID assembly (Moulded Interconnect Device - 3D assembly). Regards Janz
Electronics Forum | Fri May 27 07:14:21 EDT 2011 | janz
Hello, I am looking for companies which supply AOI for 3D - MID substrates. (MID- moulded interconnect devices). Regards Janz
Electronics Forum | Thu May 01 18:17:09 EDT 2008 | jmelson
I just got done analyzing an old piece of gear with relabeled parts. We had a schematic of the boards, with no info other than the OEM's part numbers and the way the chips were interconnected. It took me no more than 15 minutes with a couple databo
Electronics Forum | Sat Aug 28 08:41:12 EDT 1999 | Tom Tellinghuisen
Wolfgang, We also tried to find generic 'guidelines' for Moisture Sensitivity levels. It would be a perfect world, if you could say that all PLCC84's were level 4 devices. Unfortunately it is not that easy. Moisture sensitivity levels are
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Electronics Forum | Sat Apr 16 13:43:53 EDT 2005 | KEN
What about electo migration? I had (what apears to be) the exact same problem you describe. X-ray and ICT fails to detect micro shorts. However, in our test, the bench functional test would show a current overload. In some cases the electro migrti
