Technical Library: motorola and rfs4000 (Page 1 of 1)

IPC Standards and Printed Electronics Monetization

Technical Library | 2013-05-23 17:41:21.0

Printed Electronics is considered by many international technologists to be a platform for manufacturing innovation. Its rich portfolio of advanced multi-functional nano-designed materials, scalable ambient processes, and high volume manufacturing technologies lends itself to offer an opportunity for sustained manufacturing innovation. The success of introducing a new manufacturing technology is strongly dependent on the ability to achieve high final product yields at current or reduced cost. In the past, standards have been the critical vehicles to enable manufacturing success... First published in the 2012 IPC APEX EXPO technical conference proceedings.

Printovate Technologies, Inc.

SnAgCuBi and SnAgCuBiSb Solder Joint Properties Investigations

Technical Library | 2008-02-05 22:48:55.0

This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb elements to the SnAgCu solders. The influence of added elements on the electrical and mechanical properties of solder joints created by these solders between PCB and electronic components were evaluated.

Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences

Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

Technical Library | 2010-05-12 16:21:05.0

Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented. This paper is about such a procedure.

Indium Corporation

The Effect of Coating and Potting on the Reliability of QFN Devices.

Technical Library | 2014-08-28 17:09:23.0

The fastest growing package types in the electronics industry today are Bottom Termination Components (BTCs). While the advantages of BTCs are well documented, they pose significant reliability challenges to users. One of the most common drivers for reliability failures is the inappropriate adoption of new technologies. This is especially true for new component packaging like BTCs. Obtaining relevant information can be difficult since information is often segmented and the focus is on design opportunities not on reliability risks (...)Commonly used conformal coating and potting processes have resulted in shortened fatigue life under thermal cycling conditions. Why do conformal coating and potting reduce fatigue life? This paper details work undertaken to understand the mechanisms underlying this reduction. Verification and determination of mechanical properties of some common materials are performed and highlighted. Recommendations for material selection and housing design are also given.

DfR Solutions

Overview of Quality and Reliability Issues in the National Technology Roadmap for Semiconductors

Technical Library | 1999-08-05 10:27:43.0

This document is an update to the 1994 Quality and Reliability Roadmap issued in support of the 1994 National Technology Roadmap for Semiconductors. This report revisits the challenges, constraints, priorities, and research needs pertaining to quality and reliability issues. It also provides key project proposals that must be implemented to address concerns about reliability attainment and defect learning. An expanded section on test-to-test, diagnostics, and failure analysis; an edited version of the Product Analysis Forum Roadmap; and an appendix containing a draft report highlighting reliability issues is included.

SEMATECH

Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages

Technical Library | 2013-01-31 18:43:15.0

There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices, the emergence of lead-free processing, and changes in device form factors. Warpage measurement has become a key measurement for analysis; prevention and prediction of interconnect defects and has been employed in failure analysis labs and production sites worldwide. First published in the 2012 IPC APEX EXPO technical conference proceedings

ZN Technologies

The Effects of Ergonomic Stressors on Process Tool Maintenance and Utilization

Technical Library | 1999-08-05 10:57:54.0

This study examines ergonomic stressors associated with front-end process tool maintenance, relates them to decreased machine utilization, and proposes solution strategies to reduce their negative impact on productivity.

SEMATECH

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