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New Equipment | Component Programming
Amikon Limited Quick Turn-Around Time Timescales within the industry are key, and your account manager will always give you an accurate lead-time for every enquiry. amikon prides ourselves on delivering goods when promised, and we can w
New Equipment | Component Counters / SMD Counters
Amikon Limited Quick Turn-Around Time Timescales within the industry are key, and your account manager will always give you an accurate lead-time for every enquiry. amikon prides ourselves on delivering goods when promised, and we can w
Electronics Forum | Mon May 12 14:49:28 EDT 2014 | davef
Hi Evtimov 'hege gave you a plausible explanation for what's going on with solder running-up the lead of your components: TOO MUCH METAL!!! I've got different one. This explanation goes along the way that you're thinking, but just opposite. The rea
Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe
I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching
Industry News | 2011-04-20 21:38:55.0
Both local and international electronics manufacturers are aware of the fact that to miss a NEPCON China event is to forego numerous exciting business opportunities. NEPCON China is a trusted barometer of the state of the electronics manufacturing industry in China and Asia.
Industry News | 2014-06-24 06:41:49.0
Essemtec’s high-speed Paraquda SMD pick-and-place system and Fino semi-automatic screen printer have recently been installed at the high-end consumer audio company, AVM-TEC, based in Denmark. The company is a small business specialising in top of the range OEM modules, DIY module based plug & play systems and Pre & Power-amp One amplifiers under the brand name Alluxity.
Technical Library | 2018-03-05 11:22:48.0
Growing demands for smaller electronic assemblies has resulted in reduced sizes of passive components, requiring the introduction of newer components, such as the 01005 devices. Component miniaturization presents significant challenges to the traditional surface mount assembly process. A successful assembly solution for these 01005 devices should be repeatable and reproducible, and should include guidelines for (i) the selection of solder paste and (ii) appropriate stencil and substrate pad design, and should ensure strict process control standards.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. Figure 29 and Figure 30 illustrate the defective U1 component pad location. The solder joint has a pad impression where it made electrical contact before the thermal cycle induced stresses caused failure. Figure 29. Macro View, BGA56 U1 Component Cross
| https://unisoft-cim.com/crosschecking-pcb-component-footprint-and-bom-footprint.html
(correct solder pad size and land pattern) for the same component listed in the Bill of Materials (BOM). The mismatch of component footprint spacing is usually an error created when components on the PCB assembly ( PCBA
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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