6 Second Cycle Time Triple Track Conveyor System (66" Track Length). With Servo Driven Vision X, Y and Z Axes. This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional for your l
Industry News | 2011-09-06 15:31:53.0
Together with MPM and Speedline as well as four other well-known EMS suppliers, ZESTRON will host an extensive, free-of-charge, one day workshop at ZESTRON’s US headquarters on September 27 and 28, 2011, from 8:15 am to 5:00 pm.
MPM125 Metal squeegee printer blade MPM UP3000 Printer Squeegee 203 / 254 / 304 / 345 / 355 / 406 / 457 / 508 / 510 MPM 125 Printer Squeegee 219 / 254 / 300 / 304 / 355 / 400 / 450 / 508 MPM UP2000 Printer Squeegee 350 / 400 / 405 MPM UP2000 Pri
MPM UP3000 Printer Squeegee 203 / 254 / 304 / 345 / 355 / 406 / 457 / 508 / 510 MPM 125 Printer Squeegee 219 / 254 / 300 / 304 / 355 / 400 / 450 / 508 MPM UP2000 Printer Squeegee 350 / 400 / 405 MPM UP2000 Printer Squeegee 203 / 250 / 254 / 300 /
Technical Library | 2020-03-12 14:14:07.0
IPC's APEX EXPO is always exciting & always fun and, most importantly, always beneficial to those who exhibit and attend. From technical conferences to standards committees to new and exciting things on the show floor - APEX 2020 was indeed a success
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
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