Electronics Forum | Fri Sep 15 11:38:19 EDT 2006 | scott
I want to thank you for your help. MPM SN's are continuous (7001 to the more current 7780's), no date included. I had already contacted MPM and their Technical Support personnel could/would not pin-point the year it was manufactured, hence the reas
Technical Library | 2009-05-14 13:57:43.0
Is screen printing technology able to keep pace with rising quality demands and increasingly complex board layouts? Or, is new jet printing technology ready to fill the gap? A comparison study between the two methods reveals some interesting differences. Screen printers offer some possibilities for optimizing solder paste deposits, but optimization is far easier and quicker with the jet printer. At the same time, the ability to print individualized deposits on every single pcb pad may be the ultimate answer to the growing quality challenge.
Technical Library | 2017-02-16 16:53:49.0
This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.This paper was originally published by SMTA in the Proceedings of SMTA International.
Career Center | Yishun, Singapore | Maintenance
To : Sir/Madam Subject: Apply for Job Dear Sir/ Madam, I write to enquire if there is a vacancy for a SMT Maintenance Engineer in your firm.I am 40 years old a permanent resident of Singapore with an IC # S6863162i and i'm still work
Career Center | Fort Worth, Texas USA | Engineering,Maintenance,Production,Quality Control,Research and Development
A mechanically-inclined, results-oriented, lean-driven professional with proven success in implementing programs that result in efficiencies and cost savings. Effectively communicates with diverse audiences, encourages training and employee developme
SMTnet Express August 29, 2013, Subscribers: 26233, Members: Companies: 13474, Users: 35110 Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging by Mike Powers, Jianbiao Pan, Julie Silk, Patrick
SMTnet Express, February 12, 2015, Subscribers: 22,336, Members: Companies: 14,215, Users: 37,692 Evaluating the Mechanical Reliability of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging under Isothermal Ageing Sabuj Mallik