Technical Library: mpm up 2000 / b (Page 1 of 1)

Process Development And Characterization Of The Stencil Printing Process For Small Apertures

Technical Library | 2008-01-16 18:25:55.0

The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability.

Speedline Technologies, Inc.

Design and Process Development for the Assembly of 01005 Passive Components

Technical Library | 2018-03-05 11:22:48.0

Growing demands for smaller electronic assemblies has resulted in reduced sizes of passive components, requiring the introduction of newer components, such as the 01005 devices. Component miniaturization presents significant challenges to the traditional surface mount assembly process. A successful assembly solution for these 01005 devices should be repeatable and reproducible, and should include guidelines for (i) the selection of solder paste and (ii) appropriate stencil and substrate pad design, and should ensure strict process control standards.

Sanmina-SCI

Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders

Technical Library | 2017-02-16 16:53:49.0

This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.This paper was originally published by SMTA in the Proceedings of SMTA International.

Auburn University

The Last Will And Testament of the BGA Void

Technical Library | 2015-01-05 17:38:26.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Rockwell Collins

Modeling and Control of SMT Manufacturing Lines Using Hybrid Dynamic Systems

Technical Library | 2012-04-05 22:53:10.0

In this paper we show how hybrid control and modeling tech-niques can be put to work for solving a problem of industrial relevance in Surface Mount Technology (SMT) manufacturing. In particular, by closing the loop over the stencil printing process, we ob

Georgia Institute of Technology

  1  

mpm up 2000 / b searches for Companies, Equipment, Machines, Suppliers & Information

Dual Lane Reflow Oven

Reflow Soldering 101 Training Course
ISVI High Resolution Fast Speed Industrial Cameras

High Speed Precision In-Line SPI System - Mirtec MS-11
FPC* - Fluid Pressure Control - Dispensing Pump

Outstanding liquid dispensing and UV curing, all within one platform, watch the video.
Flux-Free Reflow Soldering

Want to know where to find the best AOI system? - Read testimonials.