Industry News | 2003-02-11 08:42:41.0
To Handle Outbound Logistics Projects for OEMs and to Gain Greater Insight into Their Customers' Requirements for Global Direct-order Fulfillment
Industry News | 2001-12-19 10:50:53.0
IPC has announced that Tom Newton has been named director of PWB Standards and Technology. In this position, Newton is responsible for new and existing standards in the areas of base materials and fabrication of printed circuit boards, as well as maintaining IPC involvement in new technologies in these same fields.
Industry News | 2003-02-22 13:30:35.0
Trains all levels of program managers within the EMS industry in operations, project management, finance, contract management and leadership skills.
Industry News | 2010-06-11 15:59:00.0
BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries® has released the A revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the computer and telecommunications industries, including design for reliability, design qualification testing, manufacturing conformance testing and quality processes.
Surface Mount Technology Association (SMTA)
Industry News | 2003-03-17 10:07:23.0
Each program is a three-day workshop consisting of refresher topics and course materials on the first two days and examinations on the third day.
Industry News | 2003-04-21 09:11:21.0
One for SMT Processes and one for SMT Systems
Industry News | 2003-04-24 08:16:54.0
http://www.smta.org/news/smta_calendar/calendar.cfm
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2003-02-03 10:00:29.0
To Support Development Efforts for a Next-generation Medical Device
