Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
SemiPack Services is an Electronic Manufacturing Support Service to the semiconductor industry. We specialize in providing support services to high-mix low-volume (HMLV) customers
New Equipment | Cleaning Equipment
Features: 1. A comprehensive cleaning system: the surface of the product residues of organic matter, inorganic substances for thorough and effective cleaning; 2. Automatic cleaning mode: in a clean room to complete the cleaning, rinsing, drying all
New Equipment | Cleaning Equipment
Features: 1. A comprehensive cleaning system: the surface of the product residues of organic matter, inorganic substances for thorough and effective cleaning; 2. Automatic cleaning mode: in a clean room to complete the cleaning, rinsing, drying all
Electronics Forum | Mon Jun 28 09:15:21 EDT 2004 | jdumont
Morning all, we have been seeing some problems with the edges of some of our BGA's curling away from the PCB after reflow. Is this possibly a moisture problem? If so what would be a good time/temp to bake them at to rectify the problem? Thanks in
Electronics Forum | Fri Feb 19 06:45:29 EST 1999 | Charles Stringer
Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. I have come accross dry nitrogen storage chambers
Used SMT Equipment | SMT Equipment
Baking SMT on a cheap kitchen toaster oven is not difficult. You just need some patience and exploration good will. In this page you will read the manual procedure to bake SMD boards into a regular kitchen toaster oven appliance. Follows information
Used SMT Equipment | Soldering - Reflow
Despatch TDF2-52-1E Bake Oven Brand: DespatchModel: TFD2-52-1ESerial number: 194309Max Operating Temperature: 343C (650F)F.A. DUCT 7.00" DIAEXH. DUCT: 2.50" x 13.5"F.A. Damper Blade Cut to: 1.38" DIA Holes 2XEXH. Damper Blade Cut to: 11.25LGMinimum p
Industry News | 2003-02-11 08:42:41.0
To Handle Outbound Logistics Projects for OEMs and to Gain Greater Insight into Their Customers' Requirements for Global Direct-order Fulfillment
Surface Mount Technology Association (SMTA)
Parts & Supplies | Chipshooters / Chip Mounters
Product size (mm): L350*W260*H235 G.W: 12KG Product material: stainless steel plate Samsung SM feeder feeding Loading Unit is made of high-quality steel baking paint, which is used for feeder offline loading, and can hold 10 feeder at the same t
Parts & Supplies | Pick and Place/Feeders
Samsung SM feeder feeding Loading Unit is made of high-quality steel baking paint, which is used for feeder offline loading, and can hold 10 feeder at the same time SM421 MVME3100 board MVME3100_SM4XX J91741034A_AS; 2. SM431 MVME3100 board MVME3
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
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Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
Reflow Profiling: Time Above Liquidus Reflow Profiling: Time Above Liquidus Despite much research and discussion on the subject of reflow profiling, many questions and a good deal of confusion still exist. What is clear is that the pains often
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/feature-content-roll-up-page/a-time-to-give-nordson-raises-more-than-1-million-for-our-communities
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Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. The decision to bake components is strictly based on the status of the humidity indicator card when the bag is opened. 5. The clock of exposure time does not always stop when previously exposed components are returned to dry storage
